AMD Opteron 3320 EE
About processor
The AMD Opteron 3320 EE processor is a solid choice for server applications, especially for those that require energy efficiency. With a low Thermal Design Power (TDP) of 25W, this processor is able to deliver excellent performance while keeping power consumption to a minimum.
With 4 cores and threads, the Opteron 3320 EE offers parallel processing capabilities, making it suitable for multi-threaded workloads and virtualization. The 8MB of L3 cache allows for faster access to frequently used data, improving overall system performance.
The base frequency of 1.9 GHz provides a reliable level of performance for standard workloads, while the max turbo frequency of 2.5 GHz offers extra processing power when needed. This flexibility makes the Opteron 3320 EE versatile enough to handle a wide range of tasks.
The 32nm technology used in this processor ensures efficient power usage and heat management, contributing to its low TDP. Overall, the AMD Opteron 3320 EE is a reliable and efficient processor that offers great performance for server applications, especially in environments where energy efficiency is a priority.
Basic
Label Name
AMD
Platform
Server
Launch Date
December 2012
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Opteron 3320 EE
Code Name
Delhi
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Performance-core Base Frequency
1.9 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
2.5 GHz
L1 Cache
192K
L2 Cache
4MB
L3 Cache
8MB shared
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket AM3+
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
32 nm
TDP
25 W
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR3
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
N/A
Benchmarks
Geekbench 5
Single Core
Score
319
Geekbench 5
Multi Core
Score
468
Passmark CPU
Single Core
Score
838
Passmark CPU
Multi Core
Score
1918
Compared to Other CPU
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core