AMD EPYC 7663P
About processor
The AMD EPYC 7663P processor is an impressive addition to the server CPU market. With a total of 56 cores and 112 threads, it offers unparalleled processing power for demanding server workloads. The 256MB L3 Cache further enhances its performance, allowing for faster data access and manipulation.
One of the standout features of the EPYC 7663P is its TDP of 240W, which is quite impressive considering the high core and thread count. This means that despite its powerful performance, it manages to operate efficiently without consuming excessive power or generating unnecessary heat.
In real-world applications, the EPYC 7663P excels in handling intensive tasks such as data analysis, virtualization, and high-performance computing. Its high core and thread count make it well-suited for multitasking and parallel processing, while the generous L3 cache ensures smooth and responsive performance.
Overall, the AMD EPYC 7663P processor is a powerhouse that caters to the demands of modern server workloads. Its exceptional core and thread count, large L3 cache, and efficient power consumption make it a top choice for businesses and data centers seeking uncompromising performance and reliability.
Basic
Label Name
AMD
Platform
Server
Launch Date
September 2023
Code Name
Milan
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
56
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
112
Basic Frequency
2.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.5GHz
L3 Cache
256MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
240W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s