AMD EPYC 72F3
About processor
The AMD EPYC 72F3 processor is a powerful and efficient CPU designed for server applications. With its 8 cores and 16 threads, this processor offers impressive multi-threaded performance, making it ideal for tasks such as data analysis, virtualization, and cloud computing. The 256MB of L3 cache ensures quick access to frequently used data, further enhancing the processor's speed and responsiveness.
One of the standout features of the EPYC 72F3 is its low thermal design power (TDP) of 180W, which means it operates with high efficiency and minimal heat output. This is crucial for server environments where heat management is a key concern. Additionally, the EPYC 72F3 is compatible with the latest server platforms, ensuring seamless integration and optimal performance.
Overall, the AMD EPYC 72F3 processor is a top-tier solution for demanding server workloads. Its combination of high core and thread count, large L3 cache, and low TDP make it a compelling choice for businesses looking for a reliable and high-performance CPU for their server infrastructure. Whether it's powering data centers or handling computational tasks, the EPYC 72F3 delivers exceptional performance and value.
Basic
Label Name
AMD
Platform
Server
Launch Date
March 2021
Code Name
Milan
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
Basic Frequency
3.7GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.1GHz
L3 Cache
256MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
180W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s
Benchmarks
Geekbench 6
Single Core
Score
1871
Geekbench 6
Multi Core
Score
10999
Geekbench 5
Single Core
Score
1268
Geekbench 5
Multi Core
Score
11104
Passmark CPU
Single Core
Score
3070
Passmark CPU
Multi Core
Score
27252
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core