Vorteile
- Höher Prozess: 2 nm (2 nm vs 3 nm)
- Neuer Erscheinungsdatum: September 2026 (September 2026 vs August 2026)
- Höher Frequenz: 4350 MHz (4.55 GHz vs 4350 MHz)
Basic
MediaTek
Markenname
Xiaomi
September 2026
Erscheinungsdatum
August 2026
SmartPhone Flagship
Plattform
SmartPhone Flagship
10 MB
System Level Cache (SLC)
16 MB
TSMC
Herstellung
TSMC
MT6995
Modellname
Xiaomi XRING O3
2x 4.55 GHz Arm C2-Ultra + 3x 4.35 GHz Arm C2-Pro + 3x 3.10 GHz Arm C2-Pro
Architektur
2x 4.35 GHz C1-Ultra + 4x 3.68 GHz C1-Premium + 4x 3.15 GHz C1-Pro
8
Kerne
10
2 nm
Prozess
3 nm
4.55 GHz
Frequenz
4350 MHz
-
Transistor-Anzahl
24 billion
GPU-Spezifikationen
Arm Mali-G2 Ultra NX
GPU-Name
G2-Ultra NX (16-core)
WQHD+
Maximale Anzeigeauflösung
-
Konnektivität
5G/4G Triple SIM Triple Active, Dual Data, SA and NSA, SA Option 2, NSA Option 3/3a/3x, NR FR1 TDD+FDD, DSS, 256QAM, VoNR, EPS fallback
Cellular specific functions
-
3GPP Release 17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD/TDD, 4G FDD/TDD, TD-SCDMA, WCDMA, EDGE, GSM
Cellular technologies
-
Sub-6 DL 5CC 350 MHz, Release 17 Enhancement, low-band DL 4x4 MIMO
Downlink functions
-
>7.4 Gbps
Download-Geschwindigkeit
-
MediaTek 5G UltraSave 2.0, Release 17 Power Saving Enhancement
Modem power saving technologies
-
Sub-6 UL 2CC 200 MHz, Release 17 Enhancement, FDD UL 2x2 MIMO, PC2
Uplink functions
-
Yes
4G-Unterstützung
-
Yes, 5G-Advanced
5G Unterstützung
-
Bluetooth 6.2, dual Bluetooth engine, up to 12 Mbps
Bluetooth
-
Wi-Fi 7 (802.11a/b/g/n/ac/ax/be), Triple Band Triple Concurrency, up to 7.3 Gbps
Wi-Fi
-
GPS, BeiDou, GLONASS, Galileo, QZSS, NavIC
Navigation
-
Speicherspezifikationen
LPDDR6 / LPDDR5X
Speichertypen
LPDDR6
10667 MT/s
Speicherfrequenz
10667 Mbps
-
Bus
4 x 24-bit (96-bit)
Verschiedenes
8.5 MB (2x 2 MB + 3x 1 MB + 3x 512 KB)
L2-Cache
12 MB
16 MB
L3-Cache
16 MB
200 MP
Maximale Kamerareolution
432 MP single camera; 64 MP + 64 MP + 50 MP triple camera
UFS 5.0
Speichertyp
-
8K at 60 FPS; 4K at 120 FPS with EIS; 4K at 240 FPS slow-motion; 4K at 60 FPS HDR
Videoaufnahme
4K at 60 FPS with AI RAW-domain noise reduction
VVC (H.266), HEVC (H.265), AVC (H.264), VP9, AV1, MV-HEVC
Video Codecs
H.266 (VVC) hardware decoding
8K at 60 FPS, 10-bit
Video-Wiedergabe
-
180 Hz
Display refresh rate
-
Armv9.3-A
Befehlssatz
ARMv9.3-A
Native AI Architecture, Dimensity Agentic AI Engine, AI Compute Fusion, Neural Graphics Architecture, AI Imaging Fusion Architecture, on-device MoE inference, edge-training LLM, KV-cache compression
AI features
SME2 CPU acceleration, 8 NX GPU neural accelerators, AI super resolution, AI frame generation, ISP AINR, DPU AI super resolution, ADSP AI engine
MediaTek NPU 1090 + Super Efficient NPU 2.0
Neuronaler Prozessor (NPU)
4-core NPU, 200 TOPS tensor, 3.13 TFLOPS vector
Benchmarks
Geekbench 6 Einzelkern
Dimensity 9600 Pro
4346
+10%
Xring O3
3945
Geekbench 6 Mehrkern
Dimensity 9600 Pro
13052
Xring O3
15221
+17%
AntuTu 11
Dimensity 9600 Pro
4838033
Xring O3
5228014
+8%
Verwandte SoC-Vergleiche
In sozialen Medien teilen
Oder verlinken Sie uns
<a href="https://cputronic.com/de/soc/compare/mediatek-dimensity-9600-pro-vs-xiaomi-xring-o3" target="_blank">MediaTek Dimensity 9600 Pro vs Xiaomi Xring O3</a>