Vorteile
- Höher Prozess: 4 nm (4 nm vs 5 nm)
- Neuer Erscheinungsdatum: May 2026 (May 2026 vs December 2020)
- Höher Frequenz: 2840 MHz (Up to 2.6GHz vs 2840 MHz)
Basic
MediaTek
Markenname
Qualcomm
May 2026
Erscheinungsdatum
December 2020
SmartPhone Mid range
Plattform
SmartPhone Flagship
MediaTek Dimensity 7500
Modellname
SM8350
4x Arm C1 Pro @ 2.6GHz + 4x Arm C1 Nano @ 2.0GHz
Architektur
1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
Octa (8)
Kerne
8
4 nm
Prozess
5 nm
Up to 2.6GHz
Frequenz
2840 MHz
GPU-Spezifikationen
Arm Mali-G625 MC2
GPU-Name
Adreno 660
-
GPU-Frequenz
840 MHz
-
FLOPS
1.72 TFLOPS
-
Shader-Einheiten
512
-
Ausführungseinheiten
2
-
OpenCL Version
2.0
-
Vulkan-Version
1.1
Primary up to 1344 x 2800; secondary up to 1300 x 1200
Maximale Anzeigeauflösung
3840 x 2160
-
DirectX-Version
12
Konnektivität
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 220MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2x2 MIMO, 256QAM VoNR / EPS fallback, Smart Network Suite 3.0
Cellular specific functions
-
2G-5G multi-mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA
Cellular technologies
-
NR DL 3CC 220MHz bandwidth, 4x4 MIMO
Downlink functions
-
5.2Gbps
Download-Geschwindigkeit
Up to 2500 Mbps
MediaTek 5G UltraSave 3.0+
Modem power saving technologies
-
256QAM NR UL 2CC, R16 UL Enhancement, 2x2 MIMO
Uplink functions
-
Up to 2T2R
Wi-Fi antenna
-
4G FDD / TDD, 4G-CA
4G-Unterstützung
LTE Cat. 22
5G FDD / TDD, SA / NSA, 5G-CA
5G Unterstützung
-
Bluetooth 5.4, Bluetooth Hybrid Coexistence, Bluetooth Long Range, Xtra Range 3.0
Bluetooth
5.2
Wi-Fi 6E (a/b/g/n/ac/ax)
Wi-Fi
6
GPS, BeiDou, Glonass, Galileo, QZSS, NavIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Speicherspezifikationen
LPDDR5
Speichertypen
LPDDR5
Up to 6400Mbps
Speicherfrequenz
3200 MHz
-
Bus
4x 16 Bit
Verschiedenes
-
L2-Cache
1 MB
-
Audio Codecs
AAC, AIFF, CAF, MP3, MP4, WAV
200MP
Maximale Kamerareolution
1x 200MP, 2x 25MP
UFS 3.1 2-lane
Speichertyp
UFS 3.0, UFS 3.1
4K30 (3840 x 2160) - 10 bit
Videoaufnahme
8K at 30FPS, 4K at 120FPS
Encode: H.264, HEVC; Decode: H.264, HEVC, VP-9
Video Codecs
H.264, H.265, VP8, VP9
4K HDR
Video-Wiedergabe
8K at 30FPS
Primary up to 144Hz; secondary up to 120Hz
Display refresh rate
-
Secondary display up to 1300 x 1200 @ 120Hz
Dual display support
-
-
TDP
10 W
Armv9.3-A
Befehlssatz
ARMv8.4-A
Generative AI support, global AI ecosystem support, on-device speech recognition, speech-to-text, text-to-speech, contextual replies, notification summarization
AI features
-
MediaTek NPU 850
Neuronaler Prozessor (NPU)
Hexagon 780
Benchmarks
Geekbench 6 Einzelkern
Dimensity 7500
1243
Snapdragon 888
1481
+19%
Geekbench 6 Mehrkern
Dimensity 7500
3569
Snapdragon 888
3794
+6%
Verwandte SoC-Vergleiche
In sozialen Medien teilen
Oder verlinken Sie uns
<a href="https://cputronic.com/de/soc/compare/mediatek-dimensity-7500-vs-qualcomm-snapdragon-888" target="_blank">MediaTek Dimensity 7500 vs Qualcomm Snapdragon 888</a>