Qualcomm Snapdragon X X1-26-100
vs
AMD Ryzen 7 7700
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X X1-26-100
and
AMD Ryzen 7 7700
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4nm (4nm vs TSMC 5nm FinFET)
- Newer Launch Date: January 2025 (January 2025 vs January 2023)
Basic
Qualcomm
Label Name
AMD
January 2025
Launch Date
January 2023
Laptop
Platform
Desktop
64-bit architecture
CPU Architecture
-
Qualcomm Oryon CPU
CPU Name
-
X1-26-100
Part Number
-
Qualcomm Snapdragon X X1-26-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 7 7700
-
Code Name
Raphael AM5
-
Generation
Zen 4
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
None
Boost Frequency
-
8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
-
Basic Frequency
3.8 GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 5.3 GHz
-
L1 Cache
512 KB
-
L2 Cache
8 MB
-
L3 Cache
32 MB
30 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AM5
-
Unlocked for Overclocking
?
AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.
Yes
4nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 5nm FinFET
-
TDP
65W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
-
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 5.0
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
Memory Specifications
16-bit x 8 channels
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
8448 MT/s
Maximum Memory Speed
2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600
-
ECC Memory Support
Yes (Requires mobo support)
GPU Specifications
Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz
Max External Display Resolution
-
Up to QHD+ 120 Hz HDR10
Max On-Device Display Resolution
-
eDP v1.4b
On-Device Display Standard
-
4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode
Video Concurrency
-
4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC
Video Decode
-
4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1
Video Encode
-
Adreno VPU
Video Processing Unit
-
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
-
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2200 MHz
-
Graphics Core Count
2
1.7 TFLOPS
Graphics Performance
-
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
45 TOPS
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
NVMe SSD over PCIe Gen 4
NVMe Support
Boot, RAID0, RAID1, RAID10
SD v3.0
SD Standard
-
3x USB4 40 Gbps, 2x USB 3.2 Gen2x1, 1x eUSB2
USB Interface Type
-
USB 4.0
USB Version
-
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic audio technology, Qualcomm aptX Audio
Audio Technology
-
Qualcomm Spectra ISP
Image Signal Processor
-
Up to 36 MP
Single Camera Support
-
4K HDR video capture
Video Capture
-
Benchmarks
Geekbench 6 Single Core
Snapdragon X X1-26-100
2248
Ryzen 7 7700
2839
+26%
Geekbench 6 Multi Core
Snapdragon X X1-26-100
11665
Ryzen 7 7700
14638
+25%
Geekbench 5 Single Core
Snapdragon X X1-26-100
1576
Ryzen 7 7700
1690
+7%
Geekbench 5 Multi Core
Snapdragon X X1-26-100
6244
+6%
Ryzen 7 7700
5882
Passmark CPU Single Core
Snapdragon X X1-26-100
2869
Ryzen 7 7700
4063
+42%
Passmark CPU Multi Core
Snapdragon X X1-26-100
16359
Ryzen 7 7700
34605
+112%
3DMark CPU Profile Single Core
Snapdragon X X1-26-100
690
Ryzen 7 7700
1050
+52%
3DMark CPU Profile Multi Core
Snapdragon X X1-26-100
5694
Ryzen 7 7700
8414
+48%
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