Qualcomm Snapdragon X Plus
vs
Intel Core 3 100U
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X Plus
and
Intel Core 3 100U
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 10 (10 vs 6)
- Higher Technology: 4nm (4nm vs Intel 7)
- Newer Launch Date: April 2024 (April 2024 vs January 2024)
Basic
Qualcomm
Label Name
Intel
April 2024
Launch Date
January 2024
Laptop
Platform
Mobile
64-bit architecture
CPU Architecture
-
Qualcomm Oryon CPU
CPU Name
-
X1P-64-100
Part Number
-
Qualcomm Snapdragon X Plus X1P-64-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
100U
-
Code Name
Raptor Lake
CPU Specifications
None
Boost Frequency
-
10
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
6
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
-
Performance-cores
2
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
4.7 GHz
-
Performance-core Base Frequency
1.2 GHz
-
Efficient-core Base Frequency
900 MHz
-
Efficient-core Max Turbo Frequency
?
Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.
3.3 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.7 GHz
-
L3 Cache
10 MB
42 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA1744
4nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Intel 7
-
TDP
15 W
-
Processor Base Power
?
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
15 W
-
Maximum Turbo Power
?
The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.
55 W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
Memory Specifications
16-bit x 8 channels
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Up to DDR5 5200 MT/s Up to DDR4 3200 MT/s Up to LPDDR5/x 5200 MT/s Up to LPDDR4x 4267 MT/s
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
96 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
8448 MT/s
Maximum Memory Speed
-
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
X1-85
GPU Part Number
-
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz
Max External Display Resolution
-
Up to UHD120 HDR10
Max On-Device Display Resolution
-
eDP v1.4b
On-Device Display Standard
-
4K 60 FPS 8-bit and 10-bit decode + 4K UHD 30 FPS 8-bit encode + 4K UHD 30 FPS 8-bit Miracast
Video Concurrency
-
4K 60 FPS 10-bit HEVC, VP9, AV1; 4K 60 FPS 8-bit H.264; 4K 120 FPS 8-bit HEVC
Video Decode
-
4K UHD 30 FPS 8-bit HEVC, AV1; 4K UHD 60 FPS 8-bit H.264
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
1.25 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1.25 GHz
DirectX 12
GPU APIs
-
3.8 TFLOPS
Graphics Performance
-
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
45 TOPS
NPU Performance
-
-
Intel Deep Learning Boost (Intel DL Boost) on CPU
?
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Yes
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
Snapdragon X65 5G Modem-RF System
Cellular Modem
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6; 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
NVMe SSD over PCIe Gen 4
NVMe Support
-
SD v3.0
SD Standard
-
4.0
UFS Version
-
3x USB-C; 3x USB4, 2x USB3.2 Gen2, 1x eUSB2
USB Interface Type
-
USB4
USB Version
-
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio technology, Qualcomm aptX Audio
Audio Technology
-
2x 36 MP
Dual Camera Support
-
Qualcomm Spectra ISP
Image Signal Processor
-
Dual 18-bit ISPs
ISP Bit Width
-
Qualcomm Secure Processing Unit with Microsoft Pluton TPM
Security Processor
-
Up to 64 MP
Single Camera Support
-
4K HDR
Video Capture
-
Benchmarks
Geekbench 6 Single Core
Snapdragon X Plus
2445
+54%
Core 3 100U
1589
Geekbench 6 Multi Core
Snapdragon X Plus
13278
+138%
Core 3 100U
5584
Passmark CPU Single Core
Snapdragon X Plus
3107
Core 3 100U
3525
+13%
Passmark CPU Multi Core
Snapdragon X Plus
21350
+93%
Core 3 100U
11049
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