Qualcomm Snapdragon X Elite
vs
AMD Ryzen 7 7735HS
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X Elite
and
AMD Ryzen 7 7735HS
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 12 (12 vs 8)
- Larger L3 Cache: 42MB (42MB vs 16 MB)
- Higher Technology: 4 nm (4 nm vs TSMC 6nm FinFET)
- Newer Launch Date: October 2023 (October 2023 vs April 2023)
Basic
Qualcomm
Label Name
AMD
October 2023
Launch Date
April 2023
Laptop
Platform
Laptop
X1E-84-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 7 7735HS
Oryon
Code Name
Rembrandt R
Samsung TSMC
Foundry
-
Oryon
Generation
Zen 3+
CPU Specifications
12
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
12
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
12
Performance-cores
-
-
Basic Frequency
3.2 GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.75 GHz
3.8 GHz
Performance-core Base Frequency
-
4.2 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
-
-
L1 Cache
512 KB
-
L2 Cache
4 MB
42MB
L3 Cache
16 MB
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP7
100MHz
Bus Frequency
-
No
Unlocked Multiplier
-
-
Unlocked for Overclocking
?
AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.
No
4 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 6nm FinFET
23-65 W
TDP
35-54W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
4.0
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
Arm-64
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
Memory Specifications
LPDDR5x-8448
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5, LPDDR5
64GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
-
Maximum Memory Speed
4x1R DDR5-4800
No
ECC Memory Support
Yes (Requires platform support)
GPU Specifications
Qualcomm Adreno
GPU Name
-
True
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ 680M
-
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2200 MHz
-
Graphics Core Count
12
4.6 TFLOPS
Graphics Performance
-
Miscellaneous
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
Benchmarks
Geekbench 6 Single Core
Snapdragon X Elite
2694
+37%
Ryzen 7 7735HS
1965
Geekbench 6 Multi Core
Snapdragon X Elite
13969
+51%
Ryzen 7 7735HS
9279
Geekbench 5 Single Core
Snapdragon X Elite
1871
+28%
Ryzen 7 7735HS
1457
Geekbench 5 Multi Core
Snapdragon X Elite
12913
+45%
Ryzen 7 7735HS
8901
Passmark CPU Single Core
Snapdragon X Elite
3895
+16%
Ryzen 7 7735HS
3371
Passmark CPU Multi Core
Snapdragon X Elite
23272
Ryzen 7 7735HS
24219
+4%
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