Intel Core Ultra 7 265HX vs Apple M3 Pro
CPU Comparison Result
Below are the results of a comparison of
Intel Core Ultra 7 265HX
and
Apple M3 Pro
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 20 (20 vs 12)
- Higher Performance-core Max Turbo Frequency: 5.3 GHz (5.3 GHz vs 4.05 GHz)
- Newer Launch Date: January 2025 (January 2025 vs October 2023)
Basic
Intel
Label Name
Apple
January 2025
Launch Date
October 2023
Laptop
Platform
Laptop
Core Ultra 7 265HX
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
M3 Pro
Arrow Lake
Code Name
Apple M3
Intel
Foundry
-
Ultra 7 (Arrow Lake)
Generation
-
CPU Specifications
20
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
20
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
8
Performance-cores
6
12
Efficient-cores
6
2.6 GHz
Performance-core Base Frequency
3.6 GHz
2.3 GHz
Efficient-core Base Frequency
2.48 GHz
5.3 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.05 GHz
4.6 GHz
Efficient-core Max Turbo Frequency
?
Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.
-
112 KB per core
L1 Cache
192K (per core)
23 MB
L2 Cache
16MB (shared)
24 MB shared
L3 Cache
-
No
Unlocked Multiplier
-
100 MHz
Bus Frequency
-
Intel Socket 1851
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Apple M-Socket
26
Multiplier
-
3 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
17-55 W
TDP
30 W
100 °C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
5
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
Memory Specifications
DDR5-6400
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5-6400
256 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
36GB
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
4
102.4 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
Yes
ECC Memory Support
-
GPU Specifications
true
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
1900 MHz
GPU Max Dynamic Frequency
-
64
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
-
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