Home / CPU Comparison / Intel Core Ultra 5 226V or Apple M5 Ultra 36 Cores: What's better?

Intel Core Ultra 5 226V

vs

Apple M5 Ultra 36 Cores

CPU Comparison Result

Below are the results of a comparison of Intel Core Ultra 5 226V and Apple M5 Ultra 36 Cores processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core Ultra 5 226V

Higher Memory Type: LPDDR5x-8533 (LPDDR5x-8533 vs Unified memory)

Apple M5 Ultra 36 Cores

More Total Cores: 36 (8 vs 36)
Newer Launch Date: August 2026 (October 2024 vs August 2026)

Basic

Intel

Label Name

Apple

October 2024

Launch Date

August 2026

Laptop

Platform

Desktop

CPU Architecture

Apple M5

CPU Name

Apple M5 Ultra

226V

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Apple M5 Ultra 36 Cores

Lunar Lake

Code Name

Intel

Foundry

Ultra 5 (Lunar Lake)

Generation

CPU Specifications

Interconnect Bandwidth

Over 4.4 TB/s

Interconnect Technology

UltraFusion quad-die architecture

Super-core Max Frequency

4.61 GHz

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Super-cores

1.6 GHz

Performance-core Base Frequency

1.1 GHz

Efficient-core Base Frequency

3.5 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

4.5 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

K per core

L1 Cache

14 MB

L2 Cache

8 MB

L3 Cache

100 MHz

Bus Frequency

BGA 2833

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

16x

Multiplier

Unlocked Multiplier

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

17-30 W

TDP

110°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

5.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Memory Specifications

LPDDR5x-8533

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Unified memory

16 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

512 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

136 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

1.2 TB/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

External Display Standard

DisplayPort 2.1, HDMI 2.1

GPU Name

Apple M5 Ultra 80-core GPU

Hardware-accelerated ray tracing

Supported

Max External Display Resolution

Up to 8K at 60Hz

Video Concurrency

Up to 33 streams of 8K ProRes 422 at 30 fps

Video Decode

H.264, HEVC, ProRes, ProRes RAW, AV1

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Intel® Arc™ 130V GPU

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

1850 MHz

GPU Max Dynamic Frequency

600 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Core Count

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Max Resolution

Up to 8K at 60Hz

Number of Displays Supported

GPU APIs

Metal

5.2 TFLOPS

Graphics Performance

Media Engine

Hardware-accelerated H.264, HEVC, ProRes and ProRes RAW; AV1 decode

Video Decode Engines

Video Encode Engines

ProRes Encode/Decode Engines