Home / CPU Comparison / Intel Core Ultra 5 225 or AMD Ryzen AI 5 435: What's better?

Intel Core Ultra 5 225

vs

AMD Ryzen AI 5 435

CPU Comparison Result

Below are the results of a comparison of Intel Core Ultra 5 225 and AMD Ryzen AI 5 435 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core Ultra 5 225

More Total Cores: 10 (10 vs 6)
Larger L3 Cache: 21 MB shared (21 MB shared vs 8 MB)

AMD Ryzen AI 5 435

Higher Technology: TSMC 4nm FinFET (7 nm vs TSMC 4nm FinFET)
Newer Launch Date: January 2026 (October 2024 vs January 2026)

Basic

Intel

Label Name

AMD

October 2024

Launch Date

January 2026

Desktop

Platform

Laptop

Core Ultra 5 225

Model Name

Ryzen AI 5 435

Arrow Lake-S

Code Name

Gorgon Point

Intel

Foundry

Ultra 5 (Arrow Lake)

Generation

2x Zen 5, 4x Zen 5c

OS Support

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

Basic Frequency

2 GHz

Max Turbo Frequency

Up to 4.5 GHz

3.3 GHz

Performance-core Base Frequency

2.7 GHz

Efficient-core Base Frequency

4.4 GHz

Efficient-core Max Turbo Frequency

4.9 GHz

Performance-core Max Turbo Frequency

112 KB per core

L1 Cache

3 MB per core

L2 Cache

6 MB

21 MB shared

L3 Cache

8 MB

100 MHz

Bus Frequency

Intel Socket 1851

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

33.0

Multiplier

Unlocked Multiplier

7 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

65 W

TDP

28W

100 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

DDR5-5600

Memory Type

DDR5 (FP8), LPDDR5X (FP8)

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

102.4 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Maximum Memory Speed

4x2R LPDDR5x-8000, DDR5-5600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Intel® Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 840M

Graphics Core Count

Graphics Frequency

2800 MHz