Home / CPU Comparison / Intel Core i9-14900HX or AMD Ryzen 7 8745HX: What's better?

Intel Core i9-14900HX

vs

AMD Ryzen 7 8745HX

CPU Comparison Result

Below are the results of a comparison of Intel Core i9-14900HX and AMD Ryzen 7 8745HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core i9-14900HX

More Total Cores: 24 (24 vs 8)
Larger L3 Cache: 36 MB (shared) (36 MB (shared) vs 32 MB)
Newer PCI Express Version: Gen 5, 16 Lanes (CPU only) (Gen 5, 16 Lanes (CPU only) vs PCIe® 5.0)

AMD Ryzen 7 8745HX

Higher Technology: TSMC 5nm FinFET (10 nm (intel 7) vs TSMC 5nm FinFET)
Newer Launch Date: April 2025 (January 2024 vs April 2025)

Basic

Intel

Label Name

AMD

January 2024

Launch Date

April 2025

Mobile

Platform

Laptop

Core i9-14900HX

Model Name

Ryzen 7 8745HX

Raptor Lake-HX

Code Name

Dragon Range

Core i9 (Raptor Lake-HX Refresh)

Generation

Zen 4

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

Basic Frequency

3.6 GHz

Max Turbo Frequency

Up to 5.1 GHz

2.2 GHz

Performance-core Base Frequency

1600 MHz up to 4.1 GHz

Efficient-core Base Frequency

up to 5.8 GHz

Performance-core Max Turbo Frequency

80 KB (per core)

L1 Cache

512 KB

2 MB (per core)

L2 Cache

8 MB

36 MB (shared)

L3 Cache

32 MB

100 MHz

Bus Frequency

Intel BGA 1964

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FL1

22.0x

Multiplier

Yes

Multiplier Unlocked

Unlocked for Overclocking

Yes

10 nm (intel 7)

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

55 W

TDP

55W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

Gen 5, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

Memory Specifications

DDR4, DDR5

Memory Type

DDR5

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64 GB

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Maximum Memory Speed

2x1R DDR5-5200, 2x2R DDR5-5200

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Intel® UHD Graphics for 14th Gen Intel® Processors

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 610M

Graphics Core Count

Graphics Frequency

2200 MHz