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Intel Core i9-14900HX

vs

Intel Core i7-14650HX

CPU Comparison Result

Below are the results of a comparison of Intel Core i9-14900HX and Intel Core i7-14650HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core i9-14900HX

More Total Cores: 24 (24 vs 16)
Higher Performance-core Max Turbo Frequency: up to 5.8 GHz (up to 5.8 GHz vs up to 5.2 GHz)
Larger L3 Cache: 36 MB (shared) (36 MB (shared) vs 30 MB (shared))

Intel Core i7-14650HX

Higher Technology: 10 nm (10 nm (intel 7) vs 10 nm)

Basic

Intel

Label Name

Intel

January 2024

Launch Date

January 2024

Mobile

Platform

Mobile

Core i9-14900HX

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core i7-14650HX

Raptor Lake-HX

Code Name

Raptor Lake-HX

Core i9 (Raptor Lake-HX Refresh)

Generation

Core i7 (Raptor Lake-HX Refresh)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.2 GHz

Performance-core Base Frequency

2.2 GHz

1600 MHz up to 4.1 GHz

Efficient-core Base Frequency

1600 MHz up to 3.7 GHz

up to 5.8 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

up to 5.2 GHz

80 KB (per core)

L1 Cache

80 KB (per core)

2 MB (per core)

L2 Cache

2 MB (per core)

36 MB (shared)

L3 Cache

30 MB (shared)

100 MHz

Bus Frequency

100 MHz

Intel BGA 1964

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 1964

22.0x

Multiplier

22.0x

Yes

Multiplier Unlocked

Yes

10 nm (intel 7)

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

10 nm

55 W

TDP

55 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

Gen 5, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 5, 16 Lanes (CPU only)

Memory Specifications

DDR4, DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4, DDR5

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes

GPU Specifications

Intel® UHD Graphics for 14th Gen Intel® Processors

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® UHD Graphics for 14th Gen Intel® Processors