Home / CPU Comparison / Intel Core i7-3930K or AMD Ryzen 7 5700U: What's better?

Intel Core i7-3930K

vs

AMD Ryzen 7 5700U

CPU Comparison Result

Below are the results of a comparison of Intel Core i7-3930K and AMD Ryzen 7 5700U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core i7-3930K

Larger L3 Cache: 12 MB (shared) (12 MB (shared) vs 8MB)
Newer PCI Express Version: Gen 3, 40 Lanes (CPU only) (Gen 3, 40 Lanes (CPU only) vs PCIe® 3.0)

AMD Ryzen 7 5700U

More Total Cores: 8 (6 vs 8)
Higher Max Turbo Frequency: Up to 4.3GHz (up to 3.8 GHz vs Up to 4.3GHz)
Higher Technology: TSMC 7nm FinFET (32 nm vs TSMC 7nm FinFET)
Higher Memory Type: DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s (DDR3 vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
Newer Launch Date: January 2021 (November 2011 vs January 2021)

Basic

Intel

Label Name

AMD

November 2011

Launch Date

January 2021

Desktop

Platform

Laptop

Core i7-3930K

Model Name

Sandy Bridge-E

Code Name

Lucienne

Core i7 (Sandy Bridge-E)

Generation

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.2 GHz

Basic Frequency

1.8GHz

up to 3.8 GHz

Max Turbo Frequency

Up to 4.3GHz

64 KB (per core)

L1 Cache

256 KB (per core)

L2 Cache

4MB

12 MB (shared)

L3 Cache

8MB

100 MHz

Bus Frequency

Intel Socket 2011

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

32.0x

Multiplier

Yes

Multiplier Unlocked

32 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

130 W

TDP

15W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

Gen 3, 40 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

2,270 million

Transistor Count

Memory Specifications

DDR3

Memory Type

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Quad-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

Graphics Frequency

1900 MHz