Home / CPU Comparison / Intel Core 5 210H or Apple M3 Max: What's better?

Intel Core 5 210H

vs

Apple M3 Max

CPU Comparison Result

Below are the results of a comparison of Intel Core 5 210H and Apple M3 Max processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core 5 210H

Higher Performance-core Max Turbo Frequency: 4.8 GHz (4.8 GHz vs 4.06 GHz)
Newer Launch Date: December 2024 (December 2024 vs October 2023)

Apple M3 Max

More Total Cores: 16 (8 vs 16)
Larger L3 Cache: 48 MB system level cache (12 MB shared vs 48 MB system level cache)
Higher Technology: 3 nm (10 nm vs 3 nm)

Basic

Intel

Label Name

Apple

December 2024

Launch Date

October 2023

Laptop

Platform

Laptop

CPU Architecture

Apple M3 performance cores + efficiency cores

CPU Name

Apple M3 Max

Core 5 210H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Apple M3 Max

Raptor Lake-H

Code Name

Intel

Foundry

TSMC

Core 5(Raptor Lake-H Refresh)

Generation

Apple M3 series

CPU Specifications

Performance Cores

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.2 GHz

Performance-core Base Frequency

1600 MHz

Efficient-core Base Frequency

3.6 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

2.75 GHz

Instruction Set Extensions

NEON

4.8 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.06 GHz

Extended Instruction Set

ARMv8-A, NEON

80 KB per core

L1 Cache

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

2 MB per core

L2 Cache

P-core cluster: 36 MB; E-core cluster: 4 MB

12 MB shared

L3 Cache

48 MB system level cache

100 MHz

Bus Frequency

Intel BGA 1744

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

22.0

Multiplier

Unlocked Multiplier

10 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

45 W

TDP

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

ARMv8-A

Transistor Count

92 billion

Memory Specifications

Memory Bus Width

512-bit

DDR4-3200, DDR5-5200

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Unified LPDDR5-6400

LPDDR5 Speed

LPDDR5-6400

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

83.2 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

400 GB/s

Maximum Memory Speed

6400 MT/s

ECC Memory Support

GPU Specifications

External Display Standard

Thunderbolt 4, HDMI 2.1

GPU Name

Apple M3 Max GPU

Max External Display Resolution

Up to three 6K 60Hz displays plus one 4K 144Hz display; or up to two 6K 60Hz displays plus one 8K 60Hz / 4K 240Hz display

Video Concurrency

Multiple streams of 4K and 8K ProRes video; AV1 decode

Video Decode

H.264, HEVC, ProRes, ProRes RAW, AV1 decode

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Video Processing Unit

Apple media engine with ProRes acceleration and AV1 decode

Iris Xe Graphics 48EU

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

GPU Base Frequency

390 MHz

GPU Max Dynamic Frequency

1400 MHz

Graphics Core Count

Number of Displays Supported

Up to 4 external displays

GPU APIs

Metal, OpenCL

Graphics Performance

Up to 14.2 TFLOPS FP32

Media Engine