Home / CPU Comparison / Apple M4 8 Cores or AMD Ryzen AI 9 H 365: What's better?

Apple M4 8 Cores

vs

AMD Ryzen AI 9 H 365

CPU Comparison Result

Below are the results of a comparison of Apple M4 8 Cores and AMD Ryzen AI 9 H 365 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M4 8 Cores

Higher Technology: 3 nm (3 nm vs TSMC 4nm FinFET)

AMD Ryzen AI 9 H 365

More Total Cores: 10 (8 vs 10)
Newer Launch Date: July 2025 (October 2024 vs July 2025)

Basic

Apple

Label Name

AMD

October 2024

Launch Date

July 2025

Laptop

Platform

Laptop

M4 8 Cores

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

AMD Ryzen AI 9 H 365

Apple M4

Code Name

Strix Point

Foundry

TSMC

Generation

Ryzen AI 300 Series

OS Support

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Basic Frequency

2 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

5 GHz

4.41 GHz

Performance-core Base Frequency

2.89 GHz

Efficient-core Base Frequency

Instruction Set Extensions

AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64

192 K per core

L1 Cache

16 MB shared

L2 Cache

10 MB

L3 Cache

24 MB

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

L2: 10 MB, L3: 24 MB

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

Multiplier

Unlocked Multiplier

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

22 W

TDP

28W

100 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

4.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

PCIe 4.0

ARMv9

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

28 billions

Transistor Count

Memory Specifications

LPDDR5X-7500

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5 (FP8), LPDDR5X (FP8)

32 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

120 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Maximum Memory Speed

DDR5-5600, LPDDR5X-8000

ECC Memory Support

GPU Specifications

Apple M4 GPU (8-core)

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon 880M

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2900 MHz

Graphics Core Count

DirectX Support

DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.

Max Resolution (DP)

Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

7680x4320 @ 60Hz

Number of Displays Supported

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

DisplayPort 2.1, HDMI 2.1, USB Type-C DisplayPort Alt Mode