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Apple M4 8 Cores

vs

AMD Ryzen 7 3700U

CPU Comparison Result

Below are the results of a comparison of Apple M4 8 Cores and AMD Ryzen 7 3700U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M4 8 Cores

More Total Cores: 8 (8 vs 4)
Higher Max Turbo Frequency: 4.4 GHz (4.4 GHz vs Up to 4.0GHz)
Higher Technology: Second-generation 3 nm (Second-generation 3 nm vs 12nm)
Higher Memory Type: LPDDR5X unified memory (LPDDR5X unified memory vs DDR4)
Newer Launch Date: October 2024 (October 2024 vs January 2019)

Basic

Apple

Label Name

AMD

October 2024

Launch Date

January 2019

Desktop

Platform

Laptop

Apple custom ARM architecture

CPU Architecture

Apple M4

CPU Name

Apple M4 8-Core

Model Name

Code Name

Picasso

TSMC

Foundry

Generation

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

Basic Frequency

2.3GHz

4.4 GHz

Max Turbo Frequency

Up to 4.0GHz

2.9 GHz

Efficient-core Max Turbo Frequency

4.4 GHz

Performance-core Max Turbo Frequency

L1 Cache

384KB

L2 Cache

2MB

L3 Cache

4MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP5

Unlocked for Overclocking

Second-generation 3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

12nm

TDP

15W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

28 billion

Transistor Count

Memory Specifications

LPDDR5X unified memory

Memory Type

DDR4

24 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 2400MT/s

120 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

7500 MT/s

Maximum Memory Speed

GPU Specifications

Thunderbolt / DisplayPort over USB-C

External Display Standard

Apple M4 8-core GPU

GPU Name

Supported

Hardware-accelerated ray tracing

One external display up to 6K at 60Hz

Max External Display Resolution

H.264, HEVC, ProRes, ProRes RAW, AV1; hardware-accelerated; frame rate not disclosed

Video Decode

H.264, HEVC, ProRes, ProRes RAW; hardware-accelerated; frame rate not disclosed

Video Encode

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Radeon™ RX Vega 10 Graphics

Graphics Core Count

Graphics Frequency

1400 MHz

One external display up to 6K at 60Hz

Max Resolution

Metal

GPU APIs

Hardware-accelerated H.264, HEVC, ProRes and ProRes RAW; AV1 decode

Media Engine

Video Decode Engines

Video Encode Engines