Apple M4 10 Cores vs AMD Ryzen 9 5900HX
CPU Comparison Result
Below are the results of a comparison of Apple M4 10 Cores and AMD Ryzen 9 5900HX processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 10 (10 vs 8)
- Higher Technology: 3 nm (3 nm vs TSMC 7nm FinFET)
- Higher Memory Type: LPDDR5X-7500 (LPDDR5X-7500 vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
- Newer Launch Date: May 2024 (May 2024 vs January 2021)
Basic
Apple
Label Name
AMD
May 2024
Launch Date
January 2021
Laptop
Platform
Laptop
M4 10 Cores
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
-
Apple M4
Code Name
Cezanne
CPU Specifications
10
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
10
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
4
Performance-cores
-
6
Efficient-cores
-
-
Basic Frequency
3.3GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.6GHz
4.51 GHz
Performance-core Base Frequency
-
2.89 GHz
Efficient-core Base Frequency
-
192K per core
L1 Cache
-
16MB shared
L2 Cache
4MB
-
L3 Cache
16MB
44
Multiplier
-
No
Unlocked Multiplier
-
Apple M-Socket
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
3 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
22 W
TDP
45+W
100°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
105°C
-
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
ARMv9
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-
28 billions
Transistor Count
-
Memory Specifications
LPDDR5X-7500
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s
32 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
-
4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
-
120 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
No
ECC Memory Support
-
GPU Specifications
Apple M4 GPU (10-core)
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
1800 MHz
GPU Max Dynamic Frequency
-
500 MHz
GPU Base Frequency
-
-
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2100 MHz
-
Graphics Core Count
8
160
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
-
4.6 TFLOPS
Graphics Performance
-
Miscellaneous
-
OS Support
Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.
Benchmarks
Geekbench 6 Single Core
Apple M4 10 Cores
3716
+103%
Ryzen 9 5900HX
1835
Geekbench 6 Multi Core
Apple M4 10 Cores
14579
+95%
Ryzen 9 5900HX
7485
Passmark CPU Single Core
Apple M4 10 Cores
4471
+40%
Ryzen 9 5900HX
3196
Passmark CPU Multi Core
Apple M4 10 Cores
25085
+11%
Ryzen 9 5900HX
22609
