Home / CPU Comparison / Apple M3 Ultra or AMD Ryzen Threadripper PRO 9995WX: What's better?

Apple M3 Ultra

vs

AMD Ryzen Threadripper PRO 9995WX

CPU Comparison Result

Below are the results of a comparison of Apple M3 Ultra and AMD Ryzen Threadripper PRO 9995WX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3 Ultra

Higher Technology: 3 nm (3 nm vs TSMC 4nm FinFET)

AMD Ryzen Threadripper PRO 9995WX

More Total Cores: 96 (32 vs 96)
Larger L3 Cache: 384 MB (96 MB system level cache vs 384 MB)
Newer Launch Date: July 2025 (March 2025 vs July 2025)

Basic

Apple

Label Name

AMD

March 2025

Launch Date

July 2025

Desktop

Platform

Desktop

Apple M3 performance cores + efficiency cores

CPU Architecture

Apple M3 Ultra

CPU Name

Apple M3 Ultra

Model Name

Ryzen Threadripper PRO 9995WX

Code Name

Shimada Peak

TSMC

Foundry

Apple M3 series

Generation

Zen 5

OS Support

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit, Windows 10 - 64-Bit Edition

CPU Specifications

Over 2.5 TB/s

Interconnect Bandwidth

UltraFusion

Interconnect Technology

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

192

Performance-cores

Efficient-cores

Basic Frequency

2.5 GHz

Max Turbo Frequency

Up to 5.4 GHz

2.75 GHz

Efficient-core Max Turbo Frequency

NEON

Instruction Set Extensions

4.05 GHz

Performance-core Max Turbo Frequency

ARMv8.6-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

7680 KB

P-core clusters: 72 MB total; E-core clusters: 8 MB total

L2 Cache

96 MB

96 MB system level cache

L3 Cache

384 MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

sTR5

Unlocked for Overclocking

Yes

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

TDP

350W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

ARMv8.6-A

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

184 billion

Transistor Count

Memory Specifications

1024-bit

Memory Bus Width

Unified LPDDR5-6400

Memory Type

DDR5

LPDDR5-6400

LPDDR5 Speed

512 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 6400 MT/s

819 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

6400 MT/s

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes (Default Enabled)

GPU Specifications

Thunderbolt 5, DisplayPort 2.1, HDMI 2.1

External Display Standard

Apple M3 Ultra GPU

GPU Name

Up to eight 6K 60Hz displays or four 8K 60Hz displays; HDMI up to 8K 60Hz or 4K 240Hz

Max External Display Resolution

Up to 24 streams of 8K ProRes 422 video

Video Concurrency

H.264, HEVC, ProRes, ProRes RAW, AV1 decode

Video Decode

H.264, HEVC, ProRes, ProRes RAW

Video Encode

Apple media engine with ProRes acceleration and AV1 decode

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Discrete Graphics Card Required

1400 MHz

GPU Max Dynamic Frequency

390 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Core Count

Up to 8 displays

Number of Displays Supported

Metal, OpenCL

GPU APIs

Up to 28.4 TFLOPS FP32