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Apple M3 Max vs AMD Ryzen 7 7735H

Apple M3 Max

AMD Ryzen 7 7735H

CPU Comparison Result

Below are the results of a comparison of Apple M3 Max and AMD Ryzen 7 7735H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3 Max

More Total Cores: 16 (16 vs 8)
Higher Technology: 3 nm (3 nm vs 6 nm)
Newer Launch Date: October 2023 (October 2023 vs January 2023)

Basic

Apple

Label Name

AMD

October 2023

Launch Date

January 2023

Laptop

Platform

Mobile

M3 Max

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 7735H

Apple M3

Code Name

Rembrandt-R

Generation

Ryzen 7 (Zen 3+ (Rembrandt))

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Basic Frequency

3.2 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.75 GHz

3.6 GHz

Performance-core Base Frequency

2.48 GHz

Efficient-core Base Frequency

4.05 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

192K per core

L1 Cache

64 KB (per core)

32MB

L2 Cache

512 KB (per core)

L3 Cache

16 MB (shared)

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FP7

Multiplier Unlocked

Bus Frequency

100 MHz

Multiplier

32.0x

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

6 nm

30 W

TDP

35 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 4, 20 Lanes (CPU only)

Memory Specifications

LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

LPDDR5 Speed

6400 MT/s

128GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

ECC Memory

Yes

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Radeon 680M