Apple M3 Max vs AMD Ryzen 5 7640H
CPU Comparison Result
Below are the results of a comparison of Apple M3 Max and AMD Ryzen 5 7640H processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 16 (16 vs 6)
- Higher Technology: 3 nm (3 nm vs 4 nm)
- Newer Launch Date: October 2023 (October 2023 vs January 2023)
Basic
Apple
Label Name
AMD
October 2023
Launch Date
January 2023
Laptop
Platform
Mobile
M3 Max
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 5 7640H
Apple M3
Code Name
Phoenix
-
Generation
Ryzen 5 (Zen 4 (Phoenix))
CPU Specifications
16
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
6
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
12
Performance-cores
-
4
Efficient-cores
-
-
Basic Frequency
4.3 GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
up to 5 GHz
3.6 GHz
Performance-core Base Frequency
-
2.48 GHz
Efficient-core Base Frequency
-
4.05 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
-
192K per core
L1 Cache
64 KB (per core)
32MB
L2 Cache
1 MB (per core)
-
L3 Cache
16 MB (shared)
Apple M-Socket
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket FP8
-
Bus Frequency
100 MHz
-
Multiplier
43.0x
-
Multiplier Unlocked
No
3 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
30 W
TDP
35 W
100°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 4, 20 Lanes (CPU only)
-
Transistors
25,000 million
Memory Specifications
LPDDR5-6400
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5
128GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
-
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
Dual-channel
-
ECC Memory
Yes
GPU Specifications
True
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon 760M
