Home / CPU Comparison / Apple M2 Ultra or AMD Ryzen 7 H 255: What's better?

Apple M2 Ultra

vs

AMD Ryzen 7 H 255

CPU Comparison Result

Below are the results of a comparison of Apple M2 Ultra and AMD Ryzen 7 H 255 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M2 Ultra

More Total Cores: 24 (24 vs 8)
Larger L3 Cache: 96 MB system level cache (96 MB system level cache vs 16 MB shared)

AMD Ryzen 7 H 255

Higher Performance-core Max Turbo Frequency: 4.9 GHz (3.50 GHz vs 4.9 GHz)
Higher Technology: 4 nm (5 nm vs 4 nm)
Newer Launch Date: January 2025 (June 2023 vs January 2025)

Basic

Apple

Label Name

AMD

June 2023

Launch Date

January 2025

Desktop

Platform

Laptop

Apple Avalanche + Apple Blizzard

CPU Architecture

Apple M2 Ultra

CPU Name

Apple M2 Ultra

Model Name

Ryzen 7 H 255

Code Name

Zen 4 (Hawk Point)

TSMC

Foundry

Apple M2 series

Generation

CPU Specifications

Over 2.5 TB/s

Interconnect Bandwidth

UltraFusion

Interconnect Technology

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

Performance-core Base Frequency

3.8 GHz

2.42 GHz

Efficient-core Max Turbo Frequency

NEON

Instruction Set Extensions

3.50 GHz

Performance-core Max Turbo Frequency

4.9 GHz

Armv8.5-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

64 K per core

P-core clusters: 72 MB total; E-core clusters: 8 MB total

L2 Cache

1 MB per core

96 MB system level cache

L3 Cache

16 MB shared

Bus Frequency

100 MHz

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

Multiplier

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

TDP

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

Armv8.5-A

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

134 billion

Transistor Count

25 billions

Memory Specifications

1024-bit

Memory Bus Width

Unified LPDDR5-6400

Memory Type

LPDDR5X-7500,DDR5-5600

LPDDR5-6400

LPDDR5 Speed

192 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

800 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

120 GB/s

6400 MT/s

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Thunderbolt 4, HDMI 2.1

External Display Standard

Apple M2 Ultra GPU

GPU Name

Up to eight 4K 60Hz displays, six 6K 60Hz displays, or three 8K 60Hz displays; HDMI up to 8K 60Hz or 4K 240Hz

Max External Display Resolution

Up to 22 streams of 8K ProRes 422 video

Video Concurrency

H.264, HEVC, ProRes, ProRes RAW

Video Decode

H.264, HEVC, ProRes, ProRes RAW

Video Encode

Apple media engine with ProRes acceleration

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 780M

1400 MHz

GPU Max Dynamic Frequency

2600 MHz

450 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

800 MHz

Graphics Core Count

Execution Units

Up to 8 displays

Number of Displays Supported