Apple M2 Ultra vs AMD Ryzen 7 5700X3D
CPU Comparison Result
Below are the results of a comparison of Apple M2 Ultra and AMD Ryzen 7 5700X3D processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 24 (24 vs 8)
- Higher Technology: 5 nm (5 nm vs 7 nm)
- Higher Memory Type: LPDDR5-6400 (LPDDR5-6400 vs DDR4)
- Newer Launch Date: January 2024 (May 2023 vs January 2024)
Basic
Apple
Label Name
AMD
May 2023
Launch Date
January 2024
Desktop
Platform
Desktop
M2 Ultra
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 7 5700X3D
Apple M2
Code Name
Vermeer
-
Generation
Ryzen 7 (Zen 3 (Vermeer))
CPU Specifications
24
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
24
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
16
Performance-cores
-
8
Efficient-cores
-
-
Basic Frequency
3 GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
up to 4.1 GHz
3.5 GHz
Performance-core Base Frequency
-
2.4 GHz
Efficient-core Base Frequency
-
192K per core
L1 Cache
64 KB (per core)
64MB shared
L2 Cache
512 KB (per core)
-
L3 Cache
96 MB (shared)
Apple M-Socket
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket AM4
-
Multiplier
30.0x
-
Bus Frequency
100 MHz
-
Multiplier Unlocked
No
5 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
60 W
TDP
105 W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
90°C
-
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 4, 20 Lanes (CPU only)
-
Transistors
8,850 million
Memory Specifications
LPDDR5-6400
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
192GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
-
16
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
Dual-channel
-
ECC Memory
Yes
GPU Specifications
True
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
N/A
Benchmarks
Geekbench 6 Single Core
Apple M2 Ultra
2645
+37%
Ryzen 7 5700X3D
1926
Geekbench 6 Multi Core
Apple M2 Ultra
20988
+100%
Ryzen 7 5700X3D
10514
Geekbench 5 Single Core
Apple M2 Ultra
1956
+19%
Ryzen 7 5700X3D
1643
Geekbench 5 Multi Core
Apple M2 Ultra
27945
+147%
Ryzen 7 5700X3D
11310
