Advantages
- Higher Technology: TSMC 4nm FinFET (5 nm vs TSMC 4nm FinFET)
- Higher Memory Type: DDR5 (FP7r2), LPDDR5X (FP7-FP8) (Unified LPDDR4X-4266 vs DDR5 (FP7r2), LPDDR5X (FP7-FP8))
- Newer Launch Date: December 2023 (November 2020 vs December 2023)
Basic
Apple
Label Name
AMD
November 2020
Launch Date
December 2023
Laptop
Platform
Laptop
Apple Firestorm + Apple Icestorm
CPU Architecture
-
Apple M1
CPU Name
-
T8103
Part Number
-
Apple M1
Model Name
Ryzen 7 8845HS
-
Code Name
Hawk Point
TSMC
Foundry
-
-
Generation
Zen 4
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
8
Total Threads
16
4
Performance-cores
-
4
Efficient-cores
-
-
Basic Frequency
3.8 GHz
-
Max Turbo Frequency
Up to 5.1 GHz
2.064 GHz
Efficient-core Max Turbo Frequency
-
NEON
Instruction Set Extensions
-
3.204 GHz
Performance-core Max Turbo Frequency
-
ARMv8.4-A, NEON
Extended Instruction Set
-
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
L1 Cache
-
P-core cluster: 12 MB; E-core cluster: 4 MB
L2 Cache
8 MB
-
L3 Cache
16 MB
-
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP7, FP7r2, FP8
-
Unlocked for Overclocking
No
5 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
-
TDP
45W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
ARMv8.4-A
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
16 billion
Transistor Count
-
Memory Specifications
128-bit
Memory Bus Width
-
Unified LPDDR4X-4266
Memory Type
DDR5 (FP7r2), LPDDR5X (FP7-FP8)
16 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
68.25 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
-
Maximum Memory Speed
4x2R DDR5-5600
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
Apple M1 GPU
GPU Name
-
H.264, HEVC (H.265); multiple 4K video streams / up to 4K 60 fps depending on codec, bitrate and app
Video Decode
-
H.264, HEVC (H.265); up to 4K 60 fps depending on profile, level and app
Video Encode
-
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ 780M
8
Graphics Core Count
12
-
Graphics Frequency
2700 MHz
Metal, OpenCL
GPU APIs
-
Up to 2.6 TFLOPS FP32
Graphics Performance
-
Media encode and decode engines
Media Engine
-
1
Video Decode Engines
-
1
Video Encode Engines
-
No
ProRes Encode/Decode Engines
-
AI Specifications
16-core Apple Neural Engine
AI Engine
-
16
Neural Engine Core Count
-
Apple Neural Engine
NPU Name
-
11 TOPS
NPU Performance
-
Connectivity
Yes
Bluetooth Support
-
Bluetooth 5.0
Bluetooth Version
-
Wi-Fi 6 (802.11ax)
Wi-Fi Standard
-
Interfaces and Ports
Yes, up to 40 Gbps
Thunderbolt Support
-
USB4
USB Version
-
Yes, up to 40 Gbps
USB4 Support
-
Miscellaneous
Yes, Apple silicon secure boot chain of trust
Hardware-Verified Secure Boot
-
Apple image signal processor
Image Signal Processor
-
KIP, FPR, SCIP, PAC, PPL
Runtime Anti-Exploitation
-
Benchmarks
Cinebench R23 Single Core
Apple M1
1512
Ryzen 7 8845HS
1763
+17%
Cinebench R23 Multi Core
Apple M1
7728
Ryzen 7 8845HS
17276
+124%
Geekbench 6 Single Core
Apple M1
2347
Ryzen 7 8845HS
2438
+4%
Geekbench 6 Multi Core
Apple M1
8341
Ryzen 7 8845HS
12035
+44%
Geekbench 5 Single Core
Apple M1
1729
Ryzen 7 8845HS
1931
+12%
Geekbench 5 Multi Core
Apple M1
7501
Ryzen 7 8845HS
11531
+54%
Passmark CPU Single Core
Apple M1
3674
Ryzen 7 8845HS
3803
+4%
Passmark CPU Multi Core
Apple M1
14128
Ryzen 7 8845HS
29702
+110%
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