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Apple M1 Pro vs AMD Ryzen 9 6900HX

Apple M1 Pro

AMD Ryzen 9 6900HX

CPU Comparison Result

Below are the results of a comparison of Apple M1 Pro and AMD Ryzen 9 6900HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M1 Pro

More Total Cores: 10 (10 vs 8)
Higher Technology: 5 nm (5 nm vs TSMC 6nm FinFET)

AMD Ryzen 9 6900HX

Newer Launch Date: January 2022 (October 2021 vs January 2022)

Basic

Apple

Label Name

AMD

October 2021

Launch Date

January 2022

Laptop

Platform

Laptop

M1 Pro

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Code Name

Rembrandt

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Basic Frequency

3.3GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.9GHz

2.0 GHz

Performance-core Base Frequency

3.2 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

192K per core

L1 Cache

512KB

24MB shared

L2 Cache

4MB

L3 Cache

16MB

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP7

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

Yes

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 6nm FinFET

30 W

TDP

45W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Memory Specifications

LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

32GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 680M

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2400 MHz

Graphics Core Count

Miscellaneous

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.