Home / CPU Comparison / AMD Ryzen Embedded R2544 or AMD Ryzen 7 8845HS: What's better?

AMD Ryzen Embedded R2544

vs

AMD Ryzen 7 8845HS

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen Embedded R2544 and AMD Ryzen 7 8845HS processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen Embedded R2544

Newer PCI Express Version: Gen 3, 16 Lanes (CPU only) (Gen 3, 16 Lanes (CPU only) vs PCIe® 4.0)

AMD Ryzen 7 8845HS

More Total Cores: 8 (4 vs 8)
Higher Max Turbo Frequency: Up to 5.1 GHz (up to 3.7 GHz vs Up to 5.1 GHz)
Larger L3 Cache: 16 MB (4 MB (shared) vs 16 MB)
Higher Technology: TSMC 4nm FinFET (12 nm vs TSMC 4nm FinFET)
Higher Memory Type: DDR5 (FP7r2), LPDDR5X (FP7-FP8) (DDR4 vs DDR5 (FP7r2), LPDDR5X (FP7-FP8))
Newer Launch Date: December 2023 (September 2022 vs December 2023)

Basic

AMD

Label Name

AMD

September 2022

Launch Date

December 2023

Desktop

Platform

Laptop

Ryzen Embedded R2544

Model Name

Ryzen 7 8845HS

Picasso

Code Name

Hawk Point

Ryzen Embedded (Zen+ (Picasso))

Generation

Zen 4

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.35 GHz

Basic Frequency

3.8 GHz

up to 3.7 GHz

Max Turbo Frequency

Up to 5.1 GHz

96 KB (per core)

L1 Cache

512 KB (per core)

L2 Cache

8 MB

4 MB (shared)

L3 Cache

16 MB

100 MHz

Bus Frequency

AMD Socket FP5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP7, FP7r2, FP8

33.5x

Multiplier

Multiplier Unlocked

Unlocked for Overclocking

12 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

45 W

TDP

45W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

Gen 3, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

4,940 million

Transistor Count

Memory Specifications

DDR4

Memory Type

DDR5 (FP7r2), LPDDR5X (FP7-FP8)

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Maximum Memory Speed

4x2R DDR5-5600

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon Vega 8

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 780M

Graphics Core Count

Graphics Frequency

2700 MHz