Home / CPU Comparison / AMD Ryzen AI 7 350 or Intel Core Ultra 5 125H: What's better?

AMD Ryzen AI 7 350

vs

Intel Core Ultra 5 125H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 7 350 and Intel Core Ultra 5 125H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 7 350

Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 7 nm)
Newer Launch Date: February 2025 (February 2025 vs December 2023)

Intel Core Ultra 5 125H

More Total Cores: 14 (8 vs 14)
Larger L3 Cache: 18 MB (16 MB vs 18 MB)

Basic

AMD

Label Name

Intel

February 2025

Launch Date

December 2023

Laptop

Platform

Laptop

Ryzen AI 7 350

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core Ultra 5 125H

Krackan Point

Code Name

Meteor Lake

4x Zen 5, 4x Zen 5c

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2 GHz

Basic Frequency

Up to 5 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

3.6 GHz

Efficient-core Base Frequency

2.3 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.5 GHz

L1 Cache

112 KB per core

8 MB

L2 Cache

14 MB

16 MB

L3 Cache

18 MB

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 2049

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

28W

TDP

28 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5600,LPDDR5x-7467

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

96GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

4x2R LPDDR5x-8000, DDR5-5600

Maximum Memory Speed

ECC Memory Support

GPU Specifications

AMD Radeon™ 860M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

3000 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Core Count