AMD Ryzen 9 9955HX3D
vs
AMD Ryzen 7 5700U

vs

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 9955HX3D and AMD Ryzen 7 5700U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • More Total Cores: 16 (16 vs 8)
  • Higher Max Turbo Frequency: Up to 5.4 GHz (Up to 5.4 GHz vs Up to 4.3GHz)
  • Larger L3 Cache: 128 MB (128 MB vs 8MB)
  • Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs TSMC 7nm FinFET)
  • Newer PCI Express Version: PCIe® 5.0 (PCIe® 5.0 vs PCIe® 3.0)
  • Higher Memory Type: DDR5 (DDR5 vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
  • Newer Launch Date: January 2025 (January 2025 vs January 2021)

Basic

AMD
Label Name
AMD
January 2025
Launch Date
January 2021
Laptop
Platform
Laptop
Ryzen 9 9955HX3D
Model Name
-
Fire Range
Code Name
Lucienne
Zen 5
Generation
-
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

16
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
32
Total Threads
16
2.5 GHz
Basic Frequency
1.8GHz
Up to 5.4 GHz
Max Turbo Frequency
Up to 4.3GHz
1280 KB
L1 Cache
-
16 MB
L2 Cache
4MB
128 MB
L3 Cache
8MB
FL1
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Yes
Unlocked for Overclocking
-
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
55W
TDP
15W
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
105°C
PCIe® 5.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
x86-64
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-

Memory Specifications

DDR5
Memory Type
DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s
96 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
-
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
2x1R DDR5-5600, 2x2R DDR5-5600
Maximum Memory Speed
-

GPU Specifications

AMD Radeon™ 610M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
2
Graphics Core Count
8
2200 MHz
Graphics Frequency
1900 MHz

Miscellaneous

Official Website
-

Benchmarks

Geekbench 6 Single Core
Ryzen 9 9955HX3D
3180 +127%
Ryzen 7 5700U
1400
Geekbench 6 Multi Core
Ryzen 9 9955HX3D
18788 +248%
Ryzen 7 5700U
5396
Passmark CPU Single Core
Ryzen 9 9955HX3D
4622 +78%
Ryzen 7 5700U
2593
Passmark CPU Multi Core
Ryzen 9 9955HX3D
67091 +323%
Ryzen 7 5700U
15856