AMD Ryzen 9 7950X3D vs Intel Core i7-3910K
CPU Comparison Result
Below are the results of a comparison of AMD Ryzen 9 7950X3D and Intel Core i7-3910K processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 16 (16 vs 6)
- Higher Max Turbo Frequency: Up to 5.7GHz (Up to 5.7GHz vs up to 3.6 GHz)
- Larger L3 Cache: 128MB (128MB vs 12 MB (shared))
- Higher Technology: TSMC 5nm FinFET (TSMC 5nm FinFET vs 32 nm)
- Newer PCI Express Version: PCIe® 5.0 (PCIe® 5.0 vs Gen 3)
- Higher Memory Type: DDR5 (DDR5 vs DDR3)
- Newer Launch Date: January 2023 (January 2023 vs July 2013)
Basic
AMD
Label Name
Intel
January 2023
Launch Date
July 2013
Desktop
Platform
Desktop
-
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Core i7-3910K
Raphael
Code Name
Sandy Bridge-E
CPU Specifications
16
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
6
32
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
4.2GHz
Basic Frequency
3 GHz
Up to 5.7GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
up to 3.6 GHz
1024KB
L1 Cache
64 KB (per core)
16MB
L2 Cache
256 KB (per core)
128MB
L3 Cache
12 MB (shared)
AM5
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel Socket 2011
TSMC 5nm FinFET
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
32 nm
120W
TDP
130 W
89°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
PCIe® 5.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 3
Memory Specifications
DDR5
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR3
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
Quad-channel
GPU Specifications
AMD Radeon™ Graphics
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
N/A
2200 MHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
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