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AMD Ryzen 9 7945HX vs Intel Core i7-14650HX

AMD Ryzen 9 7945HX

Intel Core i7-14650HX

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 7945HX and Intel Core i7-14650HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 7945HX

Larger L3 Cache: 64MB (64MB vs 30 MB (shared))
Higher Technology: TSMC 5nm FinFET (TSMC 5nm FinFET vs 10 nm)

Intel Core i7-14650HX

Newer PCI Express Version: Gen 5, 16 Lanes (CPU only) (PCIe® 5.0 vs Gen 5, 16 Lanes (CPU only))
Newer Launch Date: January 2024 (January 2023 vs January 2024)

Basic

AMD

Label Name

Intel

January 2023

Launch Date

January 2024

Laptop

Platform

Mobile

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core i7-14650HX

Dragon Range

Code Name

Raptor Lake-HX

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.5GHz

Basic Frequency

Up to 5.4GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

2.2 GHz

Efficient-core Base Frequency

1600 MHz up to 3.7 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

up to 5.2 GHz

1024KB

L1 Cache

80 KB (per core)

16MB

L2 Cache

2 MB (per core)

64MB

L3 Cache

30 MB (shared)

FL1

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 1964

TSMC 5nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

10 nm

55W

TDP

55 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 5.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 5, 16 Lanes (CPU only)

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4, DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

GPU Specifications

AMD Radeon™ 610M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

UHD Graphics 710

2200 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.