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AMD Ryzen 9 7900 vs AMD Ryzen 7 5700X3D

AMD Ryzen 9 7900

AMD Ryzen 7 5700X3D

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 7900 and AMD Ryzen 7 5700X3D processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 7900

More Total Cores: 12 (12 vs 8)
Higher Max Turbo Frequency: Up to 5.4GHz (Up to 5.4GHz vs up to 4.1 GHz)
Higher Technology: TSMC 5nm FinFET (TSMC 5nm FinFET vs 7 nm)
Higher Memory Type: DDR5 (DDR5 vs DDR4)

AMD Ryzen 7 5700X3D

Larger L3 Cache: 96 MB (shared) (64MB vs 96 MB (shared))
Newer PCI Express Version: Gen 4, 20 Lanes (CPU only) (PCIe® 5.0 vs Gen 4, 20 Lanes (CPU only))
Newer Launch Date: January 2024 (January 2023 vs January 2024)

Basic

AMD

Label Name

AMD

January 2023

Launch Date

January 2024

Desktop

Platform

Desktop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 5700X3D

Raphael

Code Name

Vermeer

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.7GHz

Basic Frequency

3 GHz

Up to 5.4GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.1 GHz

768KB

L1 Cache

64 KB (per core)

12MB

L2 Cache

512 KB (per core)

64MB

L3 Cache

96 MB (shared)

AM5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket AM4

TSMC 5nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

65W

TDP

105 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

90°C

PCIe® 5.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 4, 20 Lanes (CPU only)

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

N/A

2200 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.