AMD Ryzen 9 6980HX vs Apple M3 Pro
CPU Comparison Result
Below are the results of a comparison of AMD Ryzen 9 6980HX and Apple M3 Pro processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 12 (8 vs 12)
- Higher Technology: 3 nm (TSMC 6nm FinFET vs 3 nm)
- Newer Launch Date: October 2023 (January 2022 vs October 2023)
Basic
AMD
Label Name
Apple
January 2022
Launch Date
October 2023
Laptop
Platform
Laptop
-
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
M3 Pro
Rembrandt
Code Name
Apple M3
CPU Specifications
8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
-
Performance-cores
6
-
Efficient-cores
6
3.3GHz
Basic Frequency
-
Up to 5.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
-
Performance-core Base Frequency
3.6 GHz
-
Efficient-core Base Frequency
2.48 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.05 GHz
512KB
L1 Cache
192K (per core)
4MB
L2 Cache
16MB (shared)
16MB
L3 Cache
-
FP7
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Apple M-Socket
Yes
Unlocked for Overclocking
?
AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.
-
TSMC 6nm FinFET
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
45W
TDP
30 W
95°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCIe® 4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
Memory Specifications
DDR5
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5-6400
-
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
36GB
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
4
GPU Specifications
AMD Radeon™ 680M
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
2400 MHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
12
Graphics Core Count
-
Miscellaneous
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.
OS Support
-
