AMD Ryzen 9 5900HX vs AMD Ryzen 9 8940H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 5900HX and AMD Ryzen 9 8940H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (TSMC 7nm FinFET vs 4 nm)
  • Higher Memory Type: DDR5-5600 (DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s vs DDR5-5600)
  • Newer Launch Date: January 2024 (January 2021 vs January 2024)

Basic

AMD
Label Name
AMD
January 2021
Launch Date
January 2024
Laptop
Platform
Laptop
-
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 9 8940H
Cezanne
Code Name
Zen 4 (Phoenix)

CPU Specifications

8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
-
Performance-cores
8
3.3GHz
Basic Frequency
-
Up to 4.6GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
-
Performance-core Base Frequency
4.0 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.2 GHz
-
L1 Cache
64K per core
4MB
L2 Cache
8MB
16MB
L3 Cache
16MB
FP6
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP8
-
Bus Frequency
100MHz
-
Multiplier
40x
-
Unlocked Multiplier
No
TSMC 7nm FinFET
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
45+W
TDP
15 W
105°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCIe® 3.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
-
Transistor Count
25 billions

Memory Specifications

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5-5600
-
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
256GB
-
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
-
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
89.6 GB/s

GPU Specifications

AMD Radeon™ Graphics
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
-
GPU Max Dynamic Frequency
2800 MHz
-
GPU Base Frequency
1500 MHz
2100 MHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
8
Graphics Core Count
-
-
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
12
-
Max Resolution
7680x4320 - 60 Hz
-
Graphics Performance
8.12 TFLOPS

Miscellaneous

-
PCIe Lanes
20
Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.
OS Support
-

Benchmarks

Geekbench 6 Single Core
Ryzen 9 5900HX
1835
Ryzen 9 8940H
2512 +37%
Geekbench 6 Multi Core
Ryzen 9 5900HX
7485
Ryzen 9 8940H
13104 +75%