Home / CPU Comparison / AMD Ryzen 7 PRO 5755G or AMD Ryzen 9 7950X3D: What's better?

AMD Ryzen 7 PRO 5755G

vs

AMD Ryzen 9 7950X3D

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 PRO 5755G and AMD Ryzen 9 7950X3D processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 PRO 5755G

Newer Launch Date: September 2024 (September 2024 vs February 2023)

AMD Ryzen 9 7950X3D

More Total Cores: 16 (8 vs 16)
Higher Max Turbo Frequency: Up to 5.7 GHz (Up to 4.6 GHz vs Up to 5.7 GHz)
Larger L3 Cache: 128 MB (16 MB vs 128 MB)
Higher Technology: TSMC 5nm FinFET (TSMC 7nm FinFET vs TSMC 5nm FinFET)
Newer PCI Express Version: PCIe® 5.0 (PCIe® 3.0 vs PCIe® 5.0)
Higher Memory Type: DDR5 (DDR4 vs DDR5)

Basic

AMD

Label Name

AMD

September 2024

Launch Date

February 2023

Desktop

Platform

Desktop

Ryzen 7 PRO 5755G

Model Name

Ryzen 9 7950X3D

Cezanne

Code Name

Raphael AM5

Zen 3

Generation

Zen 4

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.8 GHz

Basic Frequency

4.2 GHz

Up to 4.6 GHz

Max Turbo Frequency

Up to 5.7 GHz

L1 Cache

1024 KB

4 MB

L2 Cache

16 MB

L3 Cache

128 MB

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

Unlocked for Overclocking

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

65W

TDP

120W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

89°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

Memory Specifications

DDR4

Memory Type

DDR5

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 3200 MT/s

Bus Speed

Maximum Memory Speed

2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes (Requires mobo support)

GPU Specifications

Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

2000 MHz

Graphics Frequency

2200 MHz