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AMD Ryzen 7 7445HS

vs

AMD Ryzen 3 5300U

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 7445HS and AMD Ryzen 3 5300U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 7445HS

More Total Cores: 6 (6 vs 4)
Higher Max Turbo Frequency: 4.7 GHz (4.7 GHz vs Up to 3.8GHz)
Larger L3 Cache: 16 MB (16 MB vs 4MB)
Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs TSMC 7nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 4.0 vs PCIe® 3.0)
Higher Memory Type: DDR5 (FP7r2), LPDDR5X (FP7-FP8) (DDR5 (FP7r2), LPDDR5X (FP7-FP8) vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
Newer Launch Date: May 2023 (May 2023 vs January 2021)

Basic

AMD

Label Name

AMD

May 2023

Launch Date

January 2021

Laptop

Platform

Laptop

Ryzen 7 7445HS

Model Name

Phoenix

Code Name

Lucienne

2x Zen 4, 4x Zen 4c

Generation

RHEL x86 64-BitUbuntu x86 64-BitWindows 11 - 64-Bit EditionWindows 10 - 64-Bit Edition

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.55 GHz

Basic Frequency

2.6GHz

4.7 GHz

Max Turbo Frequency

Up to 3.8GHz

6 MB

L2 Cache

2MB

16 MB

L3 Cache

4MB

FP7, FP7r2

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

TDP

15W

100

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

Memory Specifications

DDR5 (FP7r2), LPDDR5X (FP7-FP8)

Memory Type

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

256

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

4x2R DDR5-5600, LPDDR5x-7500

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ 740M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

2700

Graphics Frequency

1500 MHz