Home / CPU Comparison / AMD Ryzen 7 170 or Apple M3: What's better?

AMD Ryzen 7 170

vs

Apple M3

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 170 and Apple M3 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 170

Newer Launch Date: October 2025 (October 2025 vs October 2023)

Apple M3

Higher Technology: 3 nm (TSMC 6nm FinFET vs 3 nm)

Basic

AMD

Label Name

Apple

October 2025

Launch Date

October 2023

Laptop

Platform

Laptop

CPU Architecture

Apple M3 performance cores + efficiency cores

CPU Name

Apple M3

Ryzen 7 170

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Apple M3

Rembrandt

Code Name

Foundry

TSMC

Zen 3+

Generation

Apple M3 series

RHEL x86 64-Bit, Ubuntu x86 64-Bit, Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition

OS Support

CPU Specifications

Performance Cores

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Efficient-cores

3.2 GHz

Basic Frequency

Up to 4.75 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

2.75 GHz

Instruction Set Extensions

NEON

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.06 GHz

Extended Instruction Set

ARMv8.6-A, NEON

512 KB

L1 Cache

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

4 MB

L2 Cache

P-core cluster: 16 MB; E-core cluster: 4 MB

16 MB

L3 Cache

FP7r2

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

TSMC 6nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

45W

TDP

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

ARMv8.6-A

Transistor Count

25 billion

Memory Specifications

Memory Bus Width

128-bit

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Unified LPDDR5-6400

LPDDR5 Speed

LPDDR5-6400

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

24 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

100 GB/s

4x1R DDR5-4800

Maximum Memory Speed

6400 MT/s

Yes (Requires platform support)

ECC Memory Support

GPU Specifications

External Display Standard

Thunderbolt 3 / USB4 with DisplayPort, HDMI

GPU Name

Apple M3 GPU

Max External Display Resolution

Up to 6K 60Hz external display; up to 5K 60Hz second external display with lid closed; HDMI up to 4K 120Hz

Video Concurrency

Hardware-accelerated video encode/decode; AV1 decode

Video Decode

H.264, HEVC, ProRes, ProRes RAW, AV1 decode

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Video Processing Unit

Apple media engine with ProRes acceleration and AV1 decode

AMD Radeon™ 680M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

GPU Max Dynamic Frequency

1400 MHz

Graphics Core Count

2200 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Number of Displays Supported

Up to 2 external displays with lid closed

GPU APIs

Metal, OpenCL

Graphics Performance

Up to 3.55 TFLOPS FP32

Media Engine

Hardware-accelerated H.264, HEVC, ProRes, ProRes RAW, and AV1 decode

Video Decode Engines

Video Encode Engines

ProRes Encode/Decode Engines

OpenCL Support