Home / CPU Comparison / AMD Ryzen 5 PRO 4650U or AMD Ryzen 3 5300U: What's better?

AMD Ryzen 5 PRO 4650U

vs

AMD Ryzen 3 5300U

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 PRO 4650U and AMD Ryzen 3 5300U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 5 PRO 4650U

More Total Cores: 6 (6 vs 4)
Higher Max Turbo Frequency: Up to 4.0GHz (Up to 4.0GHz vs Up to 3.8GHz)
Larger L3 Cache: 8MB (8MB vs 4MB)

AMD Ryzen 3 5300U

Newer Launch Date: January 2021 (May 2020 vs January 2021)

Basic

AMD

Label Name

AMD

May 2020

Launch Date

January 2021

Laptop

Platform

Laptop

Renoir

Code Name

Lucienne

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

2.1GHz

Basic Frequency

2.6GHz

Up to 4.0GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 3.8GHz

3MB

L2 Cache

2MB

8MB

L3 Cache

4MB

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

15W

TDP

15W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

Memory Specifications

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

1500 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1500 MHz