AMD Ryzen 5 5500X3D vs Intel Core Ultra 7 265K
CPU Comparison Result
Below are the results of a comparison of AMD Ryzen 5 5500X3D and Intel Core Ultra 7 265K processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Larger L3 Cache: 96 MB (96 MB vs 24 MB shared)
- More Total Cores: 20 (6 vs 20)
- Higher Performance-core Max Turbo Frequency: 5.5 GHz (4.0 GHz vs 5.5 GHz)
- Higher Technology: 3 nm (7 nm vs 3 nm)
- Higher Memory Type: DDR5-6400 (DDR4-3200 vs DDR5-6400)
- Newer Launch Date: December 2024 (September 2024 vs December 2024)
Basic
AMD
Label Name
Intel
September 2024
Launch Date
December 2024
Desktop
Platform
Desktop
Ryzen 5 5500X3D
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Core Ultra 7 265K
Vermeer
Code Name
Arrow Lake-S
TSMC
Foundry
Intel
Ryzen 5 (Zen 3 (Vermeer))
Generation
Ultra 7 (Arrow Lake-S)
CPU Specifications
6
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
20
12
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
20
-
Performance-cores
8
-
Efficient-cores
12
3.0 GHz
Performance-core Base Frequency
3.3 GHz
-
Efficient-core Base Frequency
1 GHz
4.0 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.5 GHz
64 KB per core
L1 Cache
112 KB per core
512 KB per core
L2 Cache
23 MB
96 MB
L3 Cache
24 MB shared
30
Multiplier
32
AMD Socket AM4
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel Socket 1851
No
Unlocked Multiplier
Yes
100 MHz
Bus Frequency
100 MHz
7 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
105 W
TDP
125 W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100 °C
4
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5
Memory Specifications
DDR4-3200
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5-6400
-
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
51.2 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
102.4 GB/s
Yes
ECC Memory Support
Yes
GPU Specifications
N/A
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
Miscellaneous
20
PCIe Lanes
-
