AMD Phenom II X4 910e
vs
Intel Core Ultra 9 285K
vs
CPU Comparison Result
Below are the results of a comparison of
AMD Phenom II X4 910e
and
Intel Core Ultra 9 285K
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 24 (4 vs 24)
- Larger L3 Cache: 36 MB shared (6 MB shared vs 36 MB shared)
- Higher Technology: 3 nm (45 nm vs 3 nm)
- Higher Memory Type: DDR5-6400 (DDR3-1333 vs DDR5-6400)
- Newer Launch Date: December 2024 (January 2010 vs December 2024)
Basic
AMD
Label Name
Intel
January 2010
Launch Date
December 2024
Desktop
Platform
Desktop
Phenom II X4 910e
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Core Ultra 9 285K
Deneb
Code Name
Arrow Lake
GlobalFoundries
Foundry
Intel
Phenom II X4 (Deneb)
Generation
Ultra 9 (Arrow Lake)
CPU Specifications
4
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
24
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
24
-
Performance-cores
8
-
Efficient-cores
16
2.6 GHz
Performance-core Base Frequency
3.7 GHz
-
Efficient-core Base Frequency
3.2 GHz
-
Efficient-core Max Turbo Frequency
?
Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.
4.6 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.7 GHz
128 KB per core
L1 Cache
-
512 KB per core
L2 Cache
40 MB
6 MB shared
L3 Cache
36 MB shared
200 MHz
Bus Frequency
100 MHz
AMD Socket AM3
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel Socket 1851
13.0
Multiplier
32
No
Unlocked Multiplier
Yes
45 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
65 W
TDP
125 W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
105 °C
2
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5
0.758 billions
Transistor Count
-
Memory Specifications
DDR3-1333
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5-6400
-
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
-
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
102.4 GB/s
Yes
ECC Memory Support
Yes
GPU Specifications
On certain motherboards (Chipset feature)
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
-
GPU Base Frequency
300 MHz
-
GPU Max Dynamic Frequency
2000 MHz
-
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
4
-
Graphics Performance
1.79 TFLOPS
Benchmarks
Geekbench 6 Single Core
Phenom II X4 910e
314
Core Ultra 9 285K
3450
+999%
Geekbench 6 Multi Core
Phenom II X4 910e
1007
Core Ultra 9 285K
23006
+2185%
Passmark CPU Single Core
Phenom II X4 910e
1070
Core Ultra 9 285K
5268
+392%
Passmark CPU Multi Core
Phenom II X4 910e
2144
Core Ultra 9 285K
67287
+3038%
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