AMD FirePro A320
vs
Qualcomm Snapdragon X2 Elite Extreme X2E-94-100

vs

CPU Comparison Result

Below are the results of a comparison of AMD FirePro A320 and Qualcomm Snapdragon X2 Elite Extreme X2E-94-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • More Total Cores: 18 (4 vs 18)
  • Higher Technology: 3nm (32 nm vs 3nm)
  • Higher Memory Type: LPDDR5x (DDR3 vs LPDDR5x)
  • Newer Launch Date: September 2025 (August 2012 vs September 2025)

Basic

AMD
Label Name
Qualcomm
August 2012
Launch Date
September 2025
Desktop
Platform
Laptop
-
CPU Architecture
ARM64-Compatible
-
CPU Name
3rd Gen Qualcomm Oryon CPU
-
Part Number
X2E-94-100
FirePro A320
Model Name
Qualcomm Snapdragon X2 Elite Extreme X2E-94-100
Trinity
Code Name
-
FirePro (Trinity)
Generation
-

CPU Specifications

-
Boost Frequency
4.7 GHz Single-Core / 4.7 GHz Dual-Core
-
Performance-core Multi-Core Max Frequency
3.6 GHz
-
Prime-core Multi-Core Max Frequency
4.4 GHz
-
Prime-cores
12
4
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
18
4
Total Threads
-
-
Performance-cores
6
3.8 GHz
Basic Frequency
-
up to 4.2 GHz
Max Turbo Frequency
-
192 KB
L1 Cache
-
4 MB (shared)
L2 Cache
-
100 MHz
Bus Frequency
-
-
Cache
53 MB
AMD Socket FM2
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
38.0x
Multiplier
-
No
Multiplier Unlocked
-
32 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3nm
100 W
TDP
-
Gen 2
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
1,303 million
Transistor Count
-

Memory Specifications

-
Memory Bus Width
192-bit
DDR3
Memory Type
LPDDR5x
-
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
128+ GB
Dual-channel
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
228 GB/s
-
Maximum Memory Speed
9523 MT/s
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-

GPU Specifications

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Display Processing Unit
Qualcomm Adreno DPU
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External Display Standard
DisplayPort 1.4
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GPU Name
Qualcomm Adreno GPU
-
GPU Part Number
X2-90
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Max External Display Resolution
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
-
Max On-Device Display Resolution
4K at 144 Hz
-
On-Device Display Standard
Embedded DisplayPort (eDP) 1.5
-
Video Concurrency
8K UHD at 30 FPS Encode + 8K at 60 FPS Decode
-
Video Decode
AV1, HEVC, AVC: Dual 8K at 60 FPS
-
Video Encode
HEVC, AVC: Dual 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
-
Video Processing Unit
Qualcomm Adreno VPU
FirePro
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
-
Graphics Frequency
1.85 GHz
-
GPU APIs
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0

AI Specifications

-
Micro NPU
Dual Micro NPU on the Qualcomm Sensing Hub
-
NPU Name
Qualcomm Hexagon NPU
-
NPU Performance
80 TOPS (INT8)

Connectivity

-
Bluetooth Connection Technology
Bluetooth LE
-
Bluetooth Version
Bluetooth 5.4
-
Cellular Bandwidth
Up to 1000 MHz (5G)
-
Cellular Modem
Snapdragon X75 5G Modem-RF System
-
Cellular Peak Download Speed
Up to 10 Gbps
-
Cellular Peak Upload Speed
Up to 3.5 Gbps
-
Wi-Fi Bands
6 GHz, 5 GHz, 2.4 GHz
-
Wi-Fi Standard
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
-
Wireless System
Qualcomm FastConnect 7800 System

Interfaces and Ports

-
PCIe Gen 4.0 Lanes
4
-
PCIe Gen 5.0 Lanes
12
-
SD Standard
SDUC with SD Express, SDXC with UHS-I
-
UFS Version
4.0
-
USB Interface Type
3x USB-C
-
USB Version
USB4 (40 Gbps)

Miscellaneous

-
Always Sensing
Supported
-
Audio Technology
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
-
Dual Camera Support
Up to 36 MP
-
Image Signal Processor
Qualcomm Spectra ISP
-
ISP Bit Width
Dual 18-bit ISPs
-
Out-of-Band Manageability
Snapdragon Guardian Technology
-
Single Camera Support
Up to 36 MP
-
Video Capture
Up to 4K, 30 FPS

Benchmarks

Passmark CPU Single Core
FirePro A320
1193
Snapdragon X2 Elite Extreme X2E-94-100
4690 +293%
Passmark CPU Multi Core
FirePro A320
2153
Snapdragon X2 Elite Extreme X2E-94-100
45506 +2014%