AMD Ryzen 7 5825C
About processor
The AMD Ryzen 7 5825C processor is an impressive addition to the Ryzen family, specifically designed for laptops. Built on TSMC's 7nm FinFET technology, this processor features 8 cores and 16 threads, making it a powerhouse for multitasking and demanding tasks. With a generous 16MB of L3 cache, the Ryzen 7 5825C can handle large amounts of data with ease.
One of the standout features of this processor is its integrated graphics model, the AMD Radeon™ Graphics, which provides excellent visual performance without the need for a dedicated GPU. This is a significant advantage for laptop users who want to experience high-quality graphics without sacrificing portability.
With a TDP of 15W, the Ryzen 7 5825C strikes a good balance between performance and power efficiency, making it suitable for a wide range of laptop designs.
In terms of performance, the Ryzen 7 5825C excels in both single-core and multi-core tasks, as evidenced by its Geekbench 6 scores of 1489 and 5449 respectively. Overall, the Ryzen 7 5825C is a top-tier processor that delivers exceptional performance for laptop users, whether they are gaming, content creation, or simply looking for a smooth and responsive computing experience.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
May 2022
Code Name
Cezanne-U
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
Basic Frequency
2.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.5GHz
L1 Cache
512KB
L2 Cache
4MB
L3 Cache
16MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
15W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
Benchmarks
Geekbench 6
Single Core
Score
1489
Geekbench 6
Multi Core
Score
5449
Geekbench 5
Single Core
Score
1257
Geekbench 5
Multi Core
Score
5065
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core