AMD Ryzen 3 PRO 3200GE
About processor
The AMD Ryzen 3 PRO 3200GE processor is a solid choice for budget-friendly desktop builds. With its 4 total cores and 4 total threads, this processor offers respectable multi-tasking performance for everyday computing tasks. The 4MB L3 cache helps to keep things running smoothly, while the 35W TDP ensures efficient power use.
One of the standout features of the Ryzen 3 PRO 3200GE is its integrated Radeon Vega 8 graphics. This means that it can handle light gaming and multimedia tasks without the need for a dedicated GPU, making it a great option for casual gamers or home entertainment systems.
In terms of performance, the Geekbench 6 scores for this processor are quite impressive. With a single-core score of 1127 and a multi-core score of 3204, the Ryzen 3 PRO 3200GE offers snappy responsiveness and smooth multitasking capabilities.
Overall, the AMD Ryzen 3 PRO 3200GE is a great choice for budget-conscious users who want solid performance for everyday computing tasks and the added bonus of integrated graphics for casual gaming and entertainment needs.
Basic
Label Name
AMD
Platform
Desktop
Launch Date
September 2019
Code Name
Picasso
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Basic Frequency
3.3GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.8GHz
L1 Cache
384KB
L2 Cache
2MB
L3 Cache
4MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AM4
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
12nm
TDP
35W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
Bus Speed
Up to 2933MT/s
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon™ Vega 8 Graphics
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1200 MHz
Benchmarks
Geekbench 6
Single Core
Score
1127
Geekbench 6
Multi Core
Score
3204
Geekbench 5
Single Core
Score
849
Geekbench 5
Multi Core
Score
2434
Passmark CPU
Single Core
Score
2135
Passmark CPU
Multi Core
Score
6858
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core