AMD Ryzen 3 5125C
About processor
The AMD Ryzen 3 5125C processor is a solid choice for those in the market for a new laptop. With its TSMC 7nm FinFET technology, this CPU provides impressive performance while maintaining energy efficiency. The 2 cores and 4 threads deliver reliable multitasking capabilities, making it suitable for everyday use, light gaming, and productivity tasks.
The integrated AMD Radeon™ Graphics model offers decent visual performance, allowing for smooth media playback and some casual gaming without the need for a dedicated GPU. The 8MB L3 cache contributes to snappy responsiveness, while the low 15W TDP ensures that the processor runs cool and quiet.
In benchmark tests, the Ryzen 3 5125C performs admirably, scoring 957 in Geekbench 6 Single Core and 1888 in Geekbench 6 Multi Core tests. This places it at the upper end of the performance spectrum for entry-level processors, making it a compelling option for budget-minded consumers.
Overall, the AMD Ryzen 3 5125C is a strong contender in the laptop CPU market, offering impressive performance, power efficiency, and value for money. Whether for work or play, this processor is more than capable of handling everyday computing needs.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
May 2022
Code Name
Cezanne-U
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
2
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Basic Frequency
3.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.0GHz
L1 Cache
128KB
L2 Cache
1MB
L3 Cache
8MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
15W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
Benchmarks
Geekbench 6
Single Core
Score
957
Geekbench 6
Multi Core
Score
1888
Geekbench 5
Single Core
Score
824
Geekbench 5
Multi Core
Score
1970
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core