Advantages
- Higher Technology: 3 nm (3 nm vs 7 nm)
- Higher Frequency: 4000 MHz (4000 MHz vs 2860 MHz)
- Newer Launch Date: October 2024 (October 2024 vs October 2019)
Basic
Qualcomm
Label Name
HiSilicon
October 2024
Launch Date
October 2019
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
TSMC
Snapdragon 8 Gen 4
Model Name
Kirin 990
2x 4 GHz – Cortex-X5
6x 0 GHz – Cortex-A730
6x 0 GHz – Cortex-A730
Architecture
2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55
8
Cores
8
3 nm
Technology
7 nm
4000 MHz
Frequency
2860 MHz
-
Transistor count
8
GPU Specifications
-
GPU name
Mali-G76 MP16
-
GPU frequency
600 MHz
-
FLOPS
0.6912 TFLOPS
-
Shading units
36
-
Execution units
16
-
OpenCL version
2.0
-
Vulkan version
1.3
3840 x 2160
Max display resolution
3360 x 1440
Connectivity
-
Download speed
Up to 4600 Mbps
LTE Cat. 24
4G support
LTE Cat. 24
Yes
5G support
Yes
5.4
Bluetooth
5.0
7
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou
Memory Specifications
-
Memory type
LPDDR4X
-
Memory frequency
2133 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
-
L2 Cache
2 MB
-
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
-
UFS 4.0
Storage type
UFS 2.1, UFS 3.0
8K at 30FPS, 4K at 120FPS
Video capture
4K at 60FPS
H.264, H.265, AV1, VP8, VP9
Video codecs
H.264, H.265, VC-1
8K at 30FPS, 4K at 120FPS
Video playback
4K at 60FPS
-
TDP
6 W
ARMv9.2-A
Instruction set
ARMv8.2-A
Hexagon
Neural processor (NPU)
Da Vinci
Benchmarks
Geekbench 6 Single Core
Snapdragon 8 Gen 4
2902
+199%
Kirin 990
971
Geekbench 6 Multi Core
Snapdragon 8 Gen 4
9840
+212%
Kirin 990
3155
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