Qualcomm Snapdragon 778G Plus
vs
MediaTek Dimensity 8350

vs

SoC Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon 778G Plus and MediaTek Dimensity 8350 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (6 nm vs 4 nm)
  • Higher Frequency: 3350 MHz (2500 MHz vs 3350 MHz)
  • Newer Launch Date: November 2024 (October 2021 vs November 2024)

Basic

Qualcomm
Label Name
MediaTek
October 2021
Launch Date
November 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
SM7325-AE
Model Name
MT6897 MT6897Z_A/ZA MT8792Z/NA
1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
Architecture
1x 3.35 GHz – Cortex-A715, 3x 3.2 GHz – Cortex-A715, 4x 2.2 GHz – Cortex-A510
8
Cores
8
6 nm
Technology
4 nm
2500 MHz
Frequency
3350 MHz

GPU Specifications

Adreno 642
GPU name
Mali-G615 MP6
550 MHz
GPU frequency
1400 MHz
0.8448 TFLOPS
FLOPS
2.1504 TFLOPS
384
Shading units
128
2
Execution units
-
2.0
OpenCL version
2.0
1.1
Vulkan version
1.3
2520 x 1080
Max display resolution
2960 x 1440
12.1
DirectX version
-

Connectivity

Up to 3700 Mbps
Download speed
Up to 5170 Mbps
LTE Cat. 24
4G support
LTE Cat. 24
Yes
5G support
Yes
5.2
Bluetooth
5.4
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR5X
3200 MHz
Memory frequency
4266 MHz
2x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

2 MB
L2 Cache
-
-
L3 cache
4 MB
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
1x 192MP
Max camera resolution
1x 320MP
UFS 2.2, UFS 3.0, UFS 3.1
Storage type
UFS 4.0
4K at 30FPS
Video capture
4K at 60FPS
H.264, H.265, VP8, VP9
Video codecs
- H.264
- H.265
- AV1
- VP9
4K at 30FPS
Video playback
4K at 60FPS
5 W
TDP
-
ARMv8.4-A
Instruction set
ARMv9-A
Hexagon 770
Neural processor (NPU)
MediaTek APU 780

Benchmarks

Geekbench 6 Single Core
Snapdragon 778G Plus
1069
Dimensity 8350
1298 +21%
Geekbench 6 Multi Core
Snapdragon 778G Plus
3008
Dimensity 8350
4368 +45%
FP32 (float)
Snapdragon 778G Plus
861
Dimensity 8350
2172 +152%
AnTuTu 10
Snapdragon 778G Plus
604344
Dimensity 8350
1417030 +134%

Comparison of Devices

3DMark Steel Nomad Light
Vivo iQOO Z6 (SDM778G+)
Qualcomm Snapdragon 778G Plus
250
Realme P3 Ultra
MediaTek Dimensity 8350
1319
3DMark Steel Nomad Light Unlimited
Honor 70
Qualcomm Snapdragon 778G Plus
244
Oppo Reno13 Pro
MediaTek Dimensity 8350
1198