Advantages
- Newer Launch Date: April 2024 (October 2021 vs April 2024)
Basic
Qualcomm
Label Name
MediaTek
October 2021
Launch Date
April 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
SM7325-AE
Model Name
Dimensity 7025
1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
Architecture
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
6x 2 GHz – Cortex-A55
8
Cores
8
6 nm
Technology
6 nm
2500 MHz
Frequency
2500 MHz
-
Transistor count
10
GPU Specifications
Adreno 642
GPU name
IMG BXM-8-256
550 MHz
GPU frequency
950 MHz
0.8448 TFLOPS
FLOPS
-
384
Shading units
18
2
Execution units
8
2.0
OpenCL version
3.0
1.1
Vulkan version
1.3
2520 x 1080
Max display resolution
2520 x 1080
12.1
DirectX version
-
Connectivity
Up to 3700 Mbps
Download speed
Up to 2770 Mbps
LTE Cat. 24
4G support
LTE Cat. 18
Yes
5G support
Yes
5.2
Bluetooth
5.3
6
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
2x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
2 MB
L2 Cache
-
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 192MP
Max camera resolution
1x 200MP
UFS 2.2, UFS 3.0, UFS 3.1
Storage type
UFS 2.2, UFS 3.1
4K at 30FPS
Video capture
2K at 30FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP9
4K at 30FPS
Video playback
2K at 30FPS
5 W
TDP
-
ARMv8.4-A
Instruction set
ARMv8.2-A
Hexagon 770
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Snapdragon 778G Plus
1069
+6%
Dimensity 7025
1004
Geekbench 6 Multi Core
Snapdragon 778G Plus
3008
+19%
Dimensity 7025
2521
AnTuTu 10
Snapdragon 778G Plus
604344
+25%
Dimensity 7025
485165
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