Advantages
- Higher Technology: 4 nm (4 nm vs 7 nm)
- Newer Launch Date: July 2025 (March 2024 vs July 2025)
Basic
Qualcomm
Label Name
HiSilicon
March 2024
Launch Date
July 2025
SmartPhone Mid range
Platform
SmartPhone Flagship
TSMC
Manufacturing
-
SM7675
Model Name
Kirin 9010s
1x 2.8 GHz – Cortex-X4
4x 2.6 GHz – Cortex-A720
3x 1.9 GHz – Cortex-A520
4x 2.6 GHz – Cortex-A720
3x 1.9 GHz – Cortex-A520
Architecture
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
8
Cores
12
4 nm
Technology
7 nm
2800 MHz
Frequency
-
GPU Specifications
Adreno 732
GPU name
-
950 MHz
GPU frequency
-
4.7308 TFLOPS
FLOPS
-
1536
Shading units
-
2
Execution units
-
2.0
OpenCL version
-
1.3
Vulkan version
-
3840 x 2160
Max display resolution
-
12.1
DirectX version
-
Connectivity
Up to 10000 Mbps
Download speed
-
LTE Cat. 24
4G support
Yes
Yes
5G support
-
5.4
Bluetooth
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
7
Wi-Fi
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
-
Memory Specifications
LPDDR5X
Memory type
-
4800 MHz
Memory frequency
-
4x 16 Bit
Memory Bus
-
Miscellaneous
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
-
1x 200MP
Max camera resolution
-
UFS 4.0
Storage type
-
8K at 30FPS, 4K at 120FPS
Video capture
-
H.264, H.265, AV1, VP8, VP9
Video codecs
-
8K at 60FPS, 4K at 120FPS
Video playback
-
ARMv9.2-A
Instruction set
-
Hexagon
Neural processor (NPU)
-
Benchmarks
Geekbench 6 Single Core
Snapdragon 7 Plus Gen 3
1906
+32%
Kirin 9010s
1442
Geekbench 6 Multi Core
Snapdragon 7 Plus Gen 3
5330
+20%
Kirin 9010s
4443
AntuTu 11
Snapdragon 7 Plus Gen 3
1660924
+29%
Kirin 9010s
1286775
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