MediaTek Dimensity 8400
vs
Qualcomm Snapdragon 870
vs
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 8400
and
Qualcomm Snapdragon 870
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4 nm (4 nm vs 7 nm)
- Higher Frequency: 3250 MHz (3250 MHz vs 3200 MHz)
- Newer Launch Date: December 2024 (December 2024 vs January 2021)
Basic
MediaTek
Label Name
Qualcomm
December 2024
Launch Date
January 2021
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
TSMC
Dimensity 8400
Model Name
SM8250-AC
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
8
Cores
8
4 nm
Technology
7 nm
3250 MHz
Frequency
3200 MHz
-
Transistor count
10.3
GPU Specifications
Mali-G720 MC7
GPU name
Adreno 650
1400 MHz
GPU frequency
670 MHz
-
FLOPS
1.3721 TFLOPS
-
Shading units
512
6
Execution units
2
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2960 x 1440
Max display resolution
3840 x 2160
-
DirectX version
12.1
Connectivity
Up to 7900 Mbps
Download speed
Up to 7500 Mbps
-
4G support
LTE Cat. 22
Yes
5G support
Yes
5.4
Bluetooth
5.2
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Memory Specifications
LPDDR5X
Memory type
LPDDR5
8533 MHz
Memory frequency
2750 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
3.5 MB
L2 Cache
1 MB
6 MB
L3 cache
-
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
1x 200MP, 2x 25MP
UFS 4.0
Storage type
UFS 3.0, UFS 3.1
4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
4K at 60FPS
Video playback
8K at 30FPS, 4K at 60FPS
-
TDP
6 W
ARMv9-A
Instruction set
ARMv8.2-A
MediaTek NPU 880
Neural processor (NPU)
Hexagon 698
Benchmarks
Geekbench 6 Single Core
Dimensity 8400
1684
+46%
Snapdragon 870
1151
Geekbench 6 Multi Core
Dimensity 8400
6970
+109%
Snapdragon 870
3336
AnTuTu 10
Dimensity 8400
1772345
+123%
Snapdragon 870
794278
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