MediaTek Dimensity 8400
vs
Qualcomm Snapdragon 8 Gen 3

vs
MediaTek Dimensity 8400 vs Qualcomm Snapdragon 8 Gen 3 mobile chipset comparison

SoC Comparison Result

MediaTek Dimensity 8400 vs Qualcomm Snapdragon 8 Gen 3

The MediaTek Dimensity 8400 uses the newer Cortex-A725 CPU architecture, but the Snapdragon 8 Gen 3 remains faster in single-threaded tasks and is noticeably stronger in graphics. The difference is much smaller in multi-core workloads: the Dimensity 8400’s eight Cortex-A725 cores allow it to come close to the Snapdragon 8 Gen 3.

Key Differences

Feature Dimensity 8400 Snapdragon 8 Gen 3
Process technology 4 nm TSMC 4 nm TSMC
CPU 1x Cortex-A725 3.25 GHz + 3x A725 3.0 GHz + 4x A725 2.1 GHz 1x Cortex-X4 3.3 GHz + 5x Cortex-A720 + 2x Cortex-A520
GPU Mali-G720 MC7 Adreno 750
Memory LPDDR5X LPDDR5X
Storage UFS 4.0 UFS 4.0
Wi-Fi Wi-Fi 6E Wi-Fi 7
Maximum video recording 4K 60 FPS 8K 30 FPS, 4K 120 FPS

The Dimensity 8400 uses eight high-performance Cortex-A725 cores without a separate efficiency-core cluster. The Snapdragon 8 Gen 3 combines a powerful Cortex-X4 with Cortex-A720 cores and two Cortex-A520 cores.

The Cortex-X4 gives the Snapdragon a significant advantage in Single-Core performance, while the gap narrows in Multi-Core performance.

CPU Performance

In Geekbench 6, the chips achieve average scores of around 1684 / 6970 points for the Dimensity 8400 and 2192 / 7085 for the Snapdragon 8 Gen 3.

The Snapdragon is approximately 30% faster in Single-Core, while the difference in Multi-Core is around 2%. The eight Cortex-A725 cores allow the Dimensity 8400 to deliver strong results in workloads capable of fully utilizing all CPU cores.

Results for specific smartphones depend more heavily on cooling, firmware, and power limits.

Smartphone Chip Geekbench 6 SC Geekbench 6 MC AnTuTu 11 Launch price
Poco X7 Pro Dimensity 8400 Ultra 1573 6102 1 930 851 from ~$299
Realme GT 7T Dimensity 8400 Max 1613 6238 2 079 848 around ~$700*
Xiaomi 14 Snapdragon 8 Gen 3 2206 6701 2 363 726 around ~$1080*
OnePlus 12 Snapdragon 8 Gen 3 2182 6465 2 401 788 from $799
  • The price was converted from the regional launch price and is provided as a reference.

The Dimensity 8400 Ultra and Dimensity 8400 Max are versions of the same platform with similar specifications, so their results can be used as a reference for the Dimensity 8400 in production smartphones.

In this selection, Snapdragon-powered devices are approximately 38% faster in Geekbench 6 Single-Core and 7% faster in Multi-Core. In AnTuTu 11, the average lead is around 19%.

The Snapdragon’s advantage is more noticeable in short single-threaded tasks, while the difference is substantially smaller under a full load across all cores.

Graphics and Gaming

The Snapdragon’s advantage is more pronounced in graphics. The Adreno 750 outperforms the Mali-G720 MC7 in demanding 3DMark tests.

Results depend on the cooling and power limits of each device, so the table shows the performance of real-world models rather than results from a reference platform.

Device Chip Solar Bay Steel Nomad Light
Poco X7 Pro Dimensity 8400 Ultra 5931 1285
Realme GT 7T Dimensity 8400 Max 6474 1417
Xiaomi 14 Snapdragon 8 Gen 3 7582 1511
OnePlus 12 Snapdragon 8 Gen 3 8360 1676

Based on the average results of these devices, the Snapdragon leads the Dimensity by approximately 29% in Solar Bay and 18% in Steel Nomad Light.

The difference is especially noticeable in Solar Bay, which evaluates ray-tracing performance.

The final result also depends on cooling: smartphones with higher power limits can sustain maximum clock speeds for longer.

Platform Features

Both chips support LPDDR5X and UFS 4.0.

The Snapdragon 8 Gen 3 additionally supports Wi-Fi 7 and video recording at up to 8K 30 FPS and 4K 120 FPS. The Dimensity 8400 is limited to Wi-Fi 6E and recording at up to 4K 60 FPS.

Which Is Faster

The Snapdragon 8 Gen 3 wins primarily thanks to its Single-Core and GPU performance. Based on the chips’ average results, its advantage in Geekbench 6 Single-Core is around 30%, while in the specific smartphones from our selection it reaches approximately 35-40%.

The situation is much closer in Multi-Core performance. The Dimensity 8400 can come close to the Snapdragon 8 Gen 3 under a full load across all cores.

In the selection shown above, the Snapdragon is approximately 18-29% faster in graphics tests.

If gaming, emulation, and maximum GPU performance are the priorities, the Snapdragon 8 Gen 3 is noticeably stronger. The Dimensity 8400 stands out for its high multi-core CPU performance in smartphones from a lower price segment.

Conclusion

The Qualcomm Snapdragon 8 Gen 3 remains the faster chip. It is approximately 30% ahead of the Dimensity 8400 in Single-Core performance and around 18-29% faster in the graphics tests shown above.

The Dimensity 8400’s main strength is Multi-Core performance. Its eight Cortex-A725 cores allow it to come close to the Snapdragon 8 Gen 3 in multi-threaded workloads despite its lower positioning.

The Dimensity 8400 is close to the Snapdragon 8 Gen 3 in multi-core CPU performance, but falls behind in single-core performance and especially in graphics.

Advantages

  • Newer Launch Date: December 2024 (December 2024 vs October 2023)
  • Higher Frequency: 3300 MHz (3250 MHz vs 3300 MHz)

Basic

MediaTek
Label Name
Qualcomm
December 2024
Launch Date
October 2023
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
TSMC
Dimensity 8400
Model Name
SM8650-AB
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Architecture
1x 3.3 GHz – Cortex-X4
5x (3x3.2 GHz/2x3.0GHz) – Cortex-A720
2x 2.3 GHz – Cortex-A520
8
Cores
8
4 nm
Technology
4 nm
3250 MHz
Frequency
3300 MHz

GPU Specifications

Mali-G720 MC7
GPU name
Adreno 750
1400 MHz
GPU frequency
770 MHz
6
Execution units
-
2.0
OpenCL version
3.0 FP
1.3
Vulkan version
-
2960 x 1440
Max display resolution
4K @ 60 Hz, QHD+ @ 144 Hz

Connectivity

Up to 7900 Mbps
Download speed
Up to 10000 Mbps
-
4G support
LTE Cat. 24
Yes
5G support
Yes
5.4
Bluetooth
5.4
6
Wi-Fi
7
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

LPDDR5X
Memory type
LPDDR5X
8533 MHz
Memory frequency
4800 MHz
4x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

3.5 MB
L2 Cache
-
6 MB
L3 cache
-
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
1x 200MP
UFS 4.0
Storage type
UFS 4.0
4K at 60FPS
Video capture
8K at 30FPS, 4K at 120FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, AV1, VP8, VP9
4K at 60FPS
Video playback
8K at 30FPS, 4K at 120FPS
ARMv9-A
Instruction set
ARMv9
MediaTek NPU 880
Neural processor (NPU)
Hexagon

Benchmarks

Geekbench 6 Single Core
Dimensity 8400
1684
Snapdragon 8 Gen 3
2192 +30%
Geekbench 6 Multi Core
Dimensity 8400
6970
Snapdragon 8 Gen 3
7085 +2%
AnTuTu 10
Dimensity 8400
1772345
Snapdragon 8 Gen 3
1933536 +9%
AntuTu 11
Dimensity 8400
1948428
Snapdragon 8 Gen 3
2345563 +20%

Comparison of Devices

3DMark Solar Bay
Infinix GT 50 Pro
MediaTek Dimensity 8400
6543
Redmagic Gaming Pad Pro
Qualcomm Snapdragon 8 Gen 3
9124
3DMark Solar Bay Extreme
Vivo iQOO Z10 Turbo
MediaTek Dimensity 8400
670
Redmagic Gaming Pad Pro
Qualcomm Snapdragon 8 Gen 3
955
3DMark Steel Nomad Light
Vivo iQOO Z10 Turbo
MediaTek Dimensity 8400
1435
Redmagic 9S Pro+
Qualcomm Snapdragon 8 Gen 3
1840
3DMark Wild Life
Infinix GT 50 Pro
MediaTek Dimensity 8400
10976
Asus ROG Phone 8 / 8 Pro
Qualcomm Snapdragon 8 Gen 3
18450
3DMark Wild Life Extreme
Infinix GT 50 Pro
MediaTek Dimensity 8400
3938
Asus ROG Phone 8 / 8 Pro
Qualcomm Snapdragon 8 Gen 3
5205
3DMark Wild Life Unlimited
Infinix GT 50 Pro
MediaTek Dimensity 8400
13048
ZTE Nubia Red Magic 9 Pro
Qualcomm Snapdragon 8 Gen 3
21026
PCMark for Android Work 3.0
Vivo iQOO Z10 Turbo
MediaTek Dimensity 8400
9483
Lenovo Legion Y700 (2025)
Qualcomm Snapdragon 8 Gen 3
25201