MediaTek Dimensity 7350 vs Qualcomm Snapdragon 778G

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 7350 and Qualcomm Snapdragon 778G mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (4 nm vs 6 nm)
  • Higher Frequency: 3000 MHz (3000 MHz vs 2400 MHz)
  • Higher Max Bandwidth: 51.2 Gbit/s (51.2 Gbit/s vs 25.6 Gbit/s)
  • Newer Launch Date: July 2024 (July 2024 vs May 2021)

Basic

MediaTek
Label Name
Qualcomm
July 2024
Launch Date
May 2021
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
-
Dimensity 7350
Model Name
SM7325
2x 3 GHz – Cortex-A715 6x 2 GHz – Cortex-A510
Architecture
1x 2.4 GHz – Kryo 670 Prime (Cortex-A78) 3x 2.2 GHz – Kryo 670 Gold (Cortex-A78) 4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
8
Cores
8
4 nm
Technology
6 nm
3000 MHz
Frequency
2400 MHz

GPU Specifications

Mali-G610 MP4
GPU name
Adreno 642L
1300 MHz
GPU frequency
490 MHz
-
Shading units
384
-
Execution units
2
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2520 x 1080
Max display resolution
2520 x 1080
-
DirectX version
12

Connectivity

LTE Cat. 21
4G support
LTE Cat. 24
Yes
5G support
5.3
Bluetooth
5.2
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
2x 16 Bit
51.2 Gbit/s
Max Bandwidth
25.6 Gbit/s

Miscellaneous

MediaTek APU 657
Neural processor (NPU)
Hexagon 770
-
L2 Cache
2 MB
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
1x 192MP, 2x 36MP
UFS 3.1
Storage type
UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
4K at 30FPS
Video capture
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP8, VP9
4K at 30FPS
Video playback
4K at 30FPS
-
TDP
5 W
ARMv9-A
Instruction set
ARMv8.4-A

Benchmarks

Geekbench 6 Single Core
Dimensity 7350
1171 +19%
Snapdragon 778G
981
Geekbench 6 Multi Core
Dimensity 7350
2674
Snapdragon 778G
2787 +4%